Method for inspecting a film carrier tape for mounting electronic components
a technology for electronic components and film carriers, applied in the direction of optical apparatus testing, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problems of insufficient inspection efficiency and inability to carry out accurate inspection, and achieve the effect of greatly improving inspection efficiency
Inactive Publication Date: 2007-08-09
MITSUI MINING & SMELTING CO LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
This approach allows for continuous, accurate inspection of multiple strips simultaneously, reducing costs and improving productivity by enabling inspection without winding shifts and allowing a single operator to handle large quantities.
Problems solved by technology
Under the existing circumstances in which a mass production is required, therefore, an inspection efficiency is still more insufficient.
For this reason, an accurate inspection cannot be carried out.
Furthermore, the slit step is carried out before the inspection due to the restrictions on the equipment of a user.
Method used
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Embodiment Construction
[0101] An embodiment (example) of the present invention will be described below in more detail with reference to the drawings.
[0102]FIG. 1 is a front view showing an apparatus for inspecting a film carrier tape for mounting electronic component according to an embodiment of the present invention, FIG. 2 is a schematic view for explaining a method for inspecting a film carrier tape for mounting electronic component according to the present invention, FIG. 3 is a top view showing a film carrier tape for mounting electronic component which is used in the apparatus for inspecting a film carrier tape for mounting electronic component according to the present invention, FIG. 4 is a perspective view showing a guide member in an inspecting section, FIG. 5 is a sectional view taken along a line A-A in FIG. 4, FIG. 6 is a sectional view showing a drive gear, FIG. 7 is a sectional view showing a back tension roller, FIG. 8 is a front view showing the reel portion of a take-up device, FIG. 9 i...
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Abstract
An apparatus and method for inspecting a film carrier tape for mounting electronic components, in which film carrier tapes for mounting electronic components provided with a plurality of electronic component mounting portions in multiple strips in a transverse direction are exactly used and which can be inspected simultaneously, so that inspection efficiency can be greatly enhanced. Furthermore, the film carrier tapes for mounting electronic components are separated into individual strips after inspection and can be taken up on individual reels without a winding shift. A film carrier tape for mounting electronic components in multiple strips, which are unwound from an unwinding device, is cut into individual film carrier tapes for mounting electronic components in strips by a slit device, then caused to run in parallel with each other and simultaneously inspected in an inspecting section, then they are simultaneously taken up on a plurality of take-up reels attached to an identical take-up shaft of a take-up device in parallel with each other, respectively.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an apparatus and method for inspecting a film carrier tape for mounting electronic components which finally inspects the defect of an appearance before shipment of a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, a T-BGA (Tape Ball Grid Array) tape, a CSP (Chip Size Package) tape, an ASIC (Application Specific Integrated Circuit) tape, a COF (Chip on Film) tape, a 2 metal (double-sided wiring) tape, a tape for multilayer wiring and the like) (which will be hereinafter referred to as a “film carrier tape for mounting electronic component) and then displays the defect of a product on a defective product through punching or the like, for example. [0003] 2. Description of the Related Art [0004] Although a demand for a printed wiring board for mounting an electronic component such as an IC (an integrated circuit) or an LSI (a large scale integrate...
Claims
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IPC IPC(8): B32B38/00B32B37/00B29C65/00H01L21/66B65D85/00G01M11/08G01M99/00H01L23/12H01L23/50H01R43/00
CPCG01M11/081G01N21/8803Y10T156/1087G01N21/956G01N21/8914A43D3/024
Inventor YAMAMOTO, MASAHIKOKANEKO, HIDEAKI
Owner MITSUI MINING & SMELTING CO LTD