Film adhesion device and film adhesion method

Abstract

A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.

Description

[0001]The disclosure of Japanese Patent Application No. JP-A-2006-171893 filed on Jun. 21, 2006 including the specification, drawings and abstract is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a film adhesion device and a film adhesion method, and more particularly to a film adhesion device and film adhesion method with which a structure having an extremely thin film thickness and a high film thickness can be formed with good yield and excellent thickness precision on a semiconductor wafer.[0004]2. Description of the Related Art[0005]In recent years, microdevices such as microsensors, microactuators, and optical switches formed by integrating minute elements that are created using semiconductor microprocessing techniques have become known as Micro Electro Mechanical Systems (MEMS).[0006]In these microsensors and so on, a structure (for example, a hollow structure or the like) may b...

AI Technical Summary

Benefits of technology

[0009]The present inventor has discovered that by minimizing the effect on the lower layer portion when a large number of films (particularly photoresist films) constituted by a thin and flexible material are mechanically adhered, another film can be laminated onto the first layer film, and as a result, a high film thickness can be achieved by laminating a large number of layers using a pre-existing thick material rather than a high film thickness material.

Problems solved by technology

However, when photoresist is applied using a roll coater method in the conventional structure forming method described above, pin holes and so on are likely to form when the coating film thickness is reduced, and when the coating film thickness is increased, waves (indicated by the virtual lines in FIG. 17) and so on are likely to form.

When the photoresist is applied using a spray method, the coating amount becomes unstable when a coating device is driven and stopped, and hence the yield is poor.

Therefore, with the conventional structure forming method described above, it is difficult to form a structure having an extremely thin film thickness while securing a predetermined thickness precision (less than 5% or the like, for example).

Also, an extremely high degree of precision (for example, thickness precision, variation, impurity concentration, and so on) is required of the material constituting the structure, and it is technically difficult to manufacture a structure having a high film thickness.

Images