Method for forming pattern, and method for manufacturing liquid crystal display
a liquid crystal display and pattern technology, applied in the field of pattern formation and pattern manufacturing, can solve the problems of high manufacturing cost, large-scale equipment such as vacuum apparatuses and cumbersome processes, and reduce the wettability of the ink with respect to the side surface of the bank, and achieve high wettability, stable formation, and high reliability.
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first embodiment
[0055]Method for Forming a Pattern
[0056]First, a bank film, which is a material to form a bank, is formed on a substrate. In the first embodiment, a treatment is carried out in order to improve adhesiveness between the bank film and a substrate P prior to form the bank film. Specifically, an HMDS treatment is carried out to the substrate P for about 120 seconds as shown in FIG. 1A. In the HMDS treatment, the surface of the substrate P is exposed to a vapor of hexamethyldisilazane ((CH3)3SiNHSi(CH3)3). The substrate P is heated (heating condition: at 95° C. and for 60 seconds) using a hot plate.
[0057]Through the above step, a HMDS layer (not shown) to improve adhesiveness between the bank and the substrate P is formed on the substrate P. The HMDS layer is formed by substituting a hydroxyl (—OH) group on the surface of the substrate P with a methyl (—CH3) group.
[0058]In this regard, if all of the hydroxyl (—OH) groups on the surface of the substrate are substituted with the methyl (—C...
second embodiment
[0131]Next, a second embodiment of the invention will now be described with reference to FIG. 6. The second embodiment uses the method for forming a pattern of the first embodiment. In the second embodiment, the same members and elements as those in the first embodiment will be given the same reference numerals as those therein, and further description thereof will be omitted.
[0132]The method for forming a pattern in the embodiment includes a bank forming step to form the bank B on the substrate P, and a material disposing step to dispose the functional liquid L to a pattern forming region A that has a line shape and partitioned by the bank B. The bank forming step employs the method of the first embodiment.
[0133]In the method for forming a pattern of the embodiment, the functional liquid L is disposed in the pattern forming region A that has a line shape and partitioned by the bank B, dried to form the wiring line 5 on the substrate P. In this case, the wiring line 5 can be made fi...
third embodiment
[0141]Next, a third embodiment according to the invention will now be described with reference to FIGS. 7, 8A and 8B. The third embodiment uses the method for manufacturing a pattern of the first embodiment. In the third embodiment, the same members and elements as those in the first and the second embodiments will be given the same reference numerals as those therein, and further description thereof will be omitted.
[0142]In FIG. 7, a first groove part 34A (wide width part) that has a first width H1 and partitioned by the bank B and a second groove part 34B (narrow width part) that has a second width H2 and connects to the first groove part 34A are formed on the substrate P. The first width H1 is larger than the diameter of a flying droplet of a functional liquid. The second width H2 is narrower than the first width H1. In other words, the second width H2 is smaller than the first width H1. In FIG. 7, the first groove part 34A is formed so as to extend in the X-axis direction while ...
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