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Heat transfer for a hard-drive pre-amp

a hard-drive and heat transfer technology, applied in the field of hard-drives, can solve the problems of affecting the performance and reliability of the hard-drive, and providing a very limited conductive heat release means, so as to improve the heat removal effect of the preamp and reduce the heat transfer

Inactive Publication Date: 2008-04-17
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The present invention has been made by observing a problem in the prior art, in that the heat generated by the preamp is not readily dissipated. While the carrier arm 250 can be used as a heat sink, the inventors of the subject application have discovered that little heat passes from the preamp 230 to the carrier arm 250. The inventors have postulated that the reason for the low heat transfer is that the polyimide layer 225 of the subst

Problems solved by technology

As the physical size of the hard drive decrease, the heat generated by the preamp affects performance and reliability of the hard drive.
Additionally, conductive pads 235 provide a very limited conductive heat release means, and suffer as well from the thermal isolation of the polyimide layer.

Method used

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  • Heat transfer for a hard-drive pre-amp
  • Heat transfer for a hard-drive pre-amp
  • Heat transfer for a hard-drive pre-amp

Examples

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Embodiment Construction

[0023]FIG. 4 depicts a preamp subassembly showing carrier plate 450 with a substrate 440 according to an embodiment of the invention. Notably, a flap 465 of stiffener material has been added to the fabrication of the substrate 440. The flap 465 is folded over the preamp 430, so as to remove heat from the top of the preamp 430. The heat removed is conducted by the flap 465 to stiffener 415, then to carrier plate 450 and to the actuator arm assembly (not shown), which acts as the conduction heat sink.

[0024]That is, as can be understood from FIG. 2, the stiffener layer 215 of the substrate 240 is in physical contact with the carrier plate 250. However, as noted above in the prior art, the heat from the preamp 230 is not conducted to the carrier plate 250 because the polyimide layer 225 of the substrate 240 acts as a barrier for heat conduction. On the other hand, the flap 465 of the embodiment of FIG. 4 has no polyimide deposited thereupon. Consequently, heat from the top of the preamp...

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Abstract

A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Description

BACKGROUND[0001]1. Field of the Invention[0002]The subject invention relates to hard drives and, more particularly for controlling the heat generated by the hard disk drive heads preamp.[0003]2. Related Art[0004]FIG. 1a depicts a prior art hard drive 100 with the cover removed, while FIG. 1b depicts an enlarged image of the preamp area. The hard disk 100 uses rotating platters (disks) 110 to store data. Each platter is rotated by a spindle (not shown) and has a smooth magnetic surface on which digital data is stored. Information is written to the disk by applying a magnetic field from a read-write head (not shown) that is attached to an actuator arm 120. For reading, the read-write head detects the magnetic flux emanating from the magnetic bits that were written onto the platter. Since the signals from the read / write head is very faint, a preamp 130 is provided in close proximity to the head. The preamp 130 is a chip that is mounted on a substrate 140. The substrate 140 is mounted o...

Claims

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Application Information

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IPC IPC(8): G11B5/55
CPCG11B25/043Y10T29/49208G11B33/1426H01L23/367H01L23/3735H05K1/0203H05K1/056H05K2201/056H05K2203/302H01L2924/0002G11B33/1406Y10T29/49222Y10T428/24273Y10T29/49204Y10T29/49169Y10T29/4921Y10T29/49124H01L2924/00
Inventor MCCASLIN, MARTIN JOHNHU, SZU-HANCAYABAN, ALEX ENRIQUEZHO, VOON YEE
Owner NITTO DENKO CORP