Heat transfer for a hard-drive pre-amp
a hard-drive and heat transfer technology, applied in the field of hard-drives, can solve the problems of affecting the performance and reliability of the hard-drive, and providing a very limited conductive heat release means, so as to improve the heat removal effect of the preamp and reduce the heat transfer
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[0023]FIG. 4 depicts a preamp subassembly showing carrier plate 450 with a substrate 440 according to an embodiment of the invention. Notably, a flap 465 of stiffener material has been added to the fabrication of the substrate 440. The flap 465 is folded over the preamp 430, so as to remove heat from the top of the preamp 430. The heat removed is conducted by the flap 465 to stiffener 415, then to carrier plate 450 and to the actuator arm assembly (not shown), which acts as the conduction heat sink.
[0024]That is, as can be understood from FIG. 2, the stiffener layer 215 of the substrate 240 is in physical contact with the carrier plate 250. However, as noted above in the prior art, the heat from the preamp 230 is not conducted to the carrier plate 250 because the polyimide layer 225 of the substrate 240 acts as a barrier for heat conduction. On the other hand, the flap 465 of the embodiment of FIG. 4 has no polyimide deposited thereupon. Consequently, heat from the top of the preamp...
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