Substrate Polishing Method and Apparatus

a substrate and polishing technology, applied in the direction of grinding machine components, grinding machines, manufacturing tools, etc., can solve the problems of affecting the polishing effect of the substrate, affecting the polishing effect, so as to improve the correction accuracy, improve the processing pressure, and improve the polishing

US20080146119A1Inactive Publication Date: 2008-06-19EBARA CORP
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
Publication Date
2008-06-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

A polishing apparatus is provided for optimizing a polishing profile in consideration of even such parameters as the temperature on the surface of an object to be polished, and the thickness of a polishing pad, in addition to a polished amount. The polishing apparatus for polishing the object to be polished under control of a control unit CU has at least two pressing sections, and comprises a top ring which can apply an arbitrary pressure to the object to be polished from each of the pressing sections, a measuring device IM for measuring a polished amount of the object to be polished, and a monitoring device SM for monitoring the object to be polished for a polishing condition. The control unit CU forces the polishing apparatus to polish the object to be polished in accordance with a simulation program for setting processing pressures required to optimize a polishing profile of the object to be polished to the top ring based on the output of the measuring device IM and the output of the monitoring device SM.
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Description

TECHNICAL FIELD

[0001] The present invention relates to a substrate polishing apparatus for polishing materials to be polished, represented by a semiconductor substrate, which can suppress a degradation in yield rate due to non-uniformity of residual films on the surface of substrates, mainly caused by aging changes of consumable materials, extend the life time of such consumable materials to reduce an operation cost, and a polishing apparatus which embodies the method.BACKGROUND ART

[0002] In recent years, as semiconductor devices are increasingly more miniaturized and complicated in element structure, the semiconductor devices tend to have increased asperities and larger steps on the surface. As a result, thin films are formed in smaller thicknesses on such steps, and open circuits can be developed due to disconnections of wires, and short circuits attributable to defective insulation between wiring layers, leading to a lower yield rate. In a planarization technology for solving such ...

Examples

Embodiment Construction

[0043]In the following, several embodiments of a polishing method and apparatus according to the present invention will be described in detail with reference to the accompanying drawings. First, one embodiment of the polishing apparatus according to the present invention will be described with reference to FIG. 1 which is a top plan view illustrating the layout and configuration of respective components in the polishing apparatus, and FIG. 2 which illustrates a perspective view of the polishing apparatus. In FIGS. 1 and 2, a transportation mechanism common to two polishing stations installed in areas A, B comprises separately installed linear transporters, each of which includes two linearly reciprocating stages that are transportation mechanisms dedicated to the two polishing stations, respectively. Specifically, the polishing apparatus illustrated in FIGS. 1 and 2 comprises four loading / unloading stages 2 for carrying wafer cassettes 1 which stock multiple wafers. A carrier robot ...