System-in-package type semiconductor device

a semiconductor device and semiconductor technology, applied in the direction of solid-state devices, transistors, basic electric elements, etc., can solve the problems of difficult manufacturing of lsi with sufficient esd tolerance, and achieve the effects of suppressing an esd current influence, reducing wiring resistance, and suppressing an influen

Inactive Publication Date: 2008-11-20
HIRATA MORIHISA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This configuration reduces wiring resistance and effectively suppresses ESD destruction by creating a controlled ESD surge current path, enhancing ESD tolerance and reducing the risk of damage to semiconductor devices.

Problems solved by technology

In particular, as miniaturization of an LSI progresses, the ESD designing in consideration of the miniaturization requires many processes at design and development stages.
Accordingly, this prior art causes variation of ESD tolerance and it is therefore difficult to manufacture an LSI with sufficient ESD tolerance.

Method used

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  • System-in-package type semiconductor device
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  • System-in-package type semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0040]FIG. 1 is a block diagram for describing a schematic circuit configuration of an LSI device according to a first embodiment. With reference to FIG. 1, the LSI device of the first embodiment includes a first power system circuit unit 101 which is operated by electric power supplied from a first power system, and a second power system circuit unit 102 which is operated by electric power supplied from a second power system.

[0041]Typical examples of the first power system circuit unit and the second power system circuit unit are a digital circuit unit and an analog circuit unit to be placed in an LSI chip. Other examples may include an LSI device configured to use different power systems between a digital internal circuit and an input / output interface circuit unit.

[0042]Moreover, the digital circuit unit, for instance, has a larger number of elements than the analog circuit unit, and the digital circuit unit, also, has a larger chip area than the analog circuit unit.

[0043]In a hyb...

second embodiment

[0081]FIG. 4A is a circuit diagram showing a schematic configuration of an LSI according to a second embodiment of the present invention. The LSI of this embodiment includes a digital circuit as a first power system circuit, and an analog circuit as a second power system circuit. Part of the analog circuit is designed as an analog macro, and the analog macro contains a first power system input / output circuit to be operated by a first power supply.

[0082]In FIG. 4A, the LSI of this embodiment includes a digital circuit unit 401 and an analog macro 402. The analog macro 402 includes an analog internal circuit 403 and an input / output circuit unit 404.

[0083]FIG. 4B is a circuit diagram showing a detailed configuration of the input / output circuit unit 404 of the analog macro. The input / output circuit unit 404 includes a first power system input / output circuit unit 405 and a second power system input / output circuit unit 406. In FIG. 4B, the input / output circuit unit 404 of the analog macro...

third embodiment

[0089]Next, a third embodiment according to the present invention will be described with reference to FIG. 5. FIG. 5 is a circuit diagram showing a schematic configuration of an LSI device of this embodiment. As described in FIG. 5, the LSI device of this embodiment includes a protection element 501 between VDD1 and GND1 which is coupled between the first power system power supply wiring 106 and the first power system ground wiring 109, and a protection element 502 between VDD2 and GND2 which is coupled between the second power system power supply wiring 113 and the second power system ground wiring 116.

[0090]In general, the power supply protection element clamps the electric potential between the power supply and the ground to the clamp potential upon application of the ESD if the potential difference between the power supply and the ground reaches or exceeds the clamp potential. Various widely known elements, such as a clamp element applying a transistor, can be used as the protec...

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Abstract

A system-in-package type semiconductor device includes a plurality of semiconductor chips, a first semiconductor chip 1110 to which electric power is supplied from first power supply wiring 1111, and first ground wiring 1112 to which the first circuit unit is coupled. Moreover, the system-in-package type semiconductor device includes a second semiconductor chip 1120 to which electric power is supplied from second power supply wiring 1124, and second ground wiring 1125 coupled to the second circuit unit. The first semiconductor chip includes a first interface circuit unit 1412, and the second circuit unit includes a second interface circuit unit 1121 configured to perform inputting or outputting of a signal to and from the first interface circuit unit. The first ground wiring 1414 is coupled to the second ground wiring 1424 through a protection circuit 1442, and the second interface circuit unit is placed in the vicinity of the first interface circuit unit.

Description

[0001]This application is a continuation-in-part of patent application Ser. No. 10 / 784,620 filed on Feb. 23, 2004.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a semiconductor integrated device, more specifically, to a system-in-package type semiconductor device including a plurality of semiconductor chips to be operated by a plurality of power supplies.[0004]2. Description of the Prior Art[0005]Along with an increase in cell density of a semiconductor integrated device (hereinafter abbreviated as an “LSI”) and advance in the digital technology in recent years, circuits including digital circuits and analog circuits in single semiconductor devices are embedded in many products. In a digital camera or video equipment, for example, a DA converter and an AD converter for converting signals between analog signals and digital signals are embedded as a single semiconductor device.[0006]Each of the digital circuit and the analog circuit em...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L23/02H01L23/34H01L21/82H01L21/822H01L27/04H01L21/8238H01L23/50H01L23/528H01L25/065H01L25/18H01L27/02H01L27/06H01L27/092H03K19/003
CPCH01L23/50H01L23/5286H01L2924/13091H01L2224/73265H01L24/48H01L23/60H01L25/0657H01L25/18H01L27/0251H01L27/0292H01L2224/16145H01L2224/48091H01L2224/48227H01L2224/731H01L2224/73207H01L2924/15311H01L2924/19041H01L2924/00014H01L2924/00H01L2924/14H01L2224/05573H01L2224/05568H01L2224/05554H01L2924/10161H01L2224/0554H01L24/05H01L2224/05599H01L2224/45099H01L2224/45015H01L2924/207H01L2224/0555H01L2224/0556
InventorHIRATA, MORIHISA
OwnerHIRATA MORIHISA