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Solid-state image sensor and automatic-focus camera using the same

a technology of automatic focus and solid-state image sensor, which is applied in the direction of camera focusing arrangement, printers, instruments, etc., can solve the problems of increasing chip cost, long development period, and huge development cost to build up the microfabrication process, so as to improve the work precision of the process, high automatic focus precision, and the effect of not increasing the manufacturing cost of the chip

Inactive Publication Date: 2009-01-29
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This design allows for high-precision automatic focus without increasing chip manufacturing costs, enabling a low-cost, compact, and precise single lens reflex camera system.

Problems solved by technology

However, a microfabrication process essentially needs to be introduced in order to reduce the pixel pitch without lowering the sensitivity, and a long development period and tremendous development costs are needed to build up the microfabrication process.
This makes it impossible to develop a low cost solid-state image sensor for automatic focus for a short period of time.
Accordingly, this method has a problem that the chip cost is increased.

Method used

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  • Solid-state image sensor and automatic-focus camera using the same
  • Solid-state image sensor and automatic-focus camera using the same
  • Solid-state image sensor and automatic-focus camera using the same

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Experimental program
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first embodiment

[0026]FIG. 1 is a figure which best illustrates a features of the present invention, and which schematically shows a plane layout of a solid-state image sensor according to the present invention. In FIG. 1, reference numeral 1 denotes a Si semiconductor substrate, 2 denoting a photodiode array constituting a linear sensor, 3 denoting an AF sensor reading circuit, 4 denoting a signal amplifying circuit amplifying a signal from an AF sensor block, and 5 denoting a power source circuit for operating analog circuits. Further, reference numeral 6 denotes an AGC circuit for determining a storage period of AF sensor and a gain of a signal output circuit, 7 denoting a logic circuit (T / G) for driving sensors, and 8 denoting a multiplexer circuit (MPX) for selecting and reading various kinds of analog signals. Further, reference numeral 9 denotes an input output circuit (I / O), and 10 denoting a scanning circuit scanning the AF sensor reading circuit 3.

[0027]The photodiode array 2 is divided i...

second embodiment

[0047]FIG. 7 shows a plane layout of a second embodiment according to the present invention. In FIG. 7, the same components as those in FIG. 1 are denoted by the same reference numerals and the explanation thereof is omitted. In the present embodiment, the base lines are arranged to overlap with each other, and photodiodes as the dummy pixel are also arranged between linear sensors without a gap. As shown in FIG. 7, the dummy pixels are provided between a pair of the linear sensor for standard portion and the linear sensor for reference portion (between the line 6-standard portion and the line 5-reference portion), and between linear sensors for standard portion (between the line 5-standard portion and the line 6-standard portion). Further, the dummy pixel is provided between the linear sensors for reference portion (between the line 5-reference portion and the line 6-reference portion). Also, there may be a case where the dummy pixel is provided only for one of the locations betwee...

third embodiment

[0049]FIGS. 8A and 8B show plane layouts in a third embodiment according to the present invention. In FIGS. 8A and 8B, the same components as those in FIG. 1 are denoted by the same reference numerals and the explanation thereof is omitted. In the present embodiment, an example in which the base lines of three linear sensors are arranged to overlap with each other, is described.

[0050]As shown in FIGS. 8A and 8B, the linear sensors for standard portion and the linear sensors for reference portion of the fifth to the seventh paired linear sensors in the present embodiment, are arranged in the order of the line 5-standard portion, the line 6-standard portion, the line 7-standard portion, the line 5-reference portion, the line 6-reference portion, and the line 7-reference portion.

[0051]In present embodiment, the linear sensors for standard portion (the line 6-standard portion, the line 7-standard portion) of the sixth and the seventh paired linear sensors are arranged between the linear...

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Abstract

A solid-state image sensor for automatic focus with highly precise automatic focus performance is realized at low cost. In the solid-state image sensor for automatic focus which has paired linear sensors (L1 to L10) respectively provided with linear sensors for standard portion (L1-B to L10-B) and linear sensors for reference portion (L1-R to L10-R) for performing phase difference detection type focus detection, a linear sensor for standard portion L6-B of paired linear sensors L6 is arranged between a linear sensor for standard portion L5-B and a linear sensor for reference portion L5-R of paired linear sensors L5, and a linear sensor for reference portion L5-R of paired linear sensors L5 is arranged between a linear sensor for standard portion L6-B and a linear sensor for reference portion L6-R of paired linear sensors L6.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an improvement in the precision of a solid-state image sensor for automatic focus, and more particularly to a TTL-SIR (Through The Lens Secondary Imaged Registration) type automatic focus sensor and an automatic-focus camera using the TTL-SIR type automatic focus sensor.[0003]2. Description of the Related Art[0004]A conventional TTL-SIR type automatic focus sensor is disclosed by the present applicants in detail in “CMOS linear type automatic focus sensor for wide visual field seven point AF, Technical Report of the Institute of Image Formation and Television Engineers, Vol. 25, No. 28, and pp. 1-6 (2001)”. FIG. 11 shows a linear sensor arrangement layout of a solid-state image sensor for automatic focus. In order to perform seven-point range finding including central cross range finding, eight paired linear sensors 131 are arranged on a same semiconductor substrate 130 corresponding to ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G03B13/32
CPCG02B7/36G02B7/34
Inventor TAKAHASHI, HIDEKAZU
Owner CANON KK