Low profile clamp for use with apparatus for thermal control in the analysis of electronic devices

Abstract

A heat spreader comprising a sheet of transparent diamond with an aperture therein that accommodates a solid-immersion lens (SIL). The heat spreader may be mounted within a clamp which allows the heat spreader to move freely across the Device Under Test (DUT) whilst maintaining a very high degree of planarity and contact between the diamond and the silicon substrate of the DUT. The DUT is secured to its electrical interface with a low profile clamp, the DUT may be held within the clamp by a mechanism that applies a pressure to the sides of the DUT package.

Description

STATEMENT OF PRIORITY[0001]This is a continuation of pending U.S. application Ser. No. 11 / 953,630 filed on Dec. 10, 2007.FIELD OF THE INVENTION[0002]The present invention relates to methods and apparatus for inspecting and analysing electronic devices such as microprocessors.BACKGROUND TO THE INVENTION[0003]One known method for inspecting and analysing electronic devices such as flip-chip packaged microprocessors involves optical or infrared probing of the electronic device. During probing, a device which includes a silicon substrate: the device under test (DUT), is powered normally and its response is measured through the back of the silicon substrate by analysing the phase shift in a laser probe. For example, a modulated 1.064 μm laser probe may be used. The laser illuminates the device through an air-gap lens or a solid-immersion-lens (SIL) and the reflected beam is collected through the same lens. As the DUT is under power, it generates a large amount of heat and needs to be act...

AI Technical Summary

Benefits of technology

[0015]The diamond heat spreader may be mounted within a heatsink. The heatsink may have a cooling ring. The cooling ring may comprise a copper plate. The copper plate may be plated with gold to prevent corrosion. The diamond sheet may be attached to the cooling ring with Indium solder. The cooling ring may be air or fluid-cooled and may include a base having a plurality of cooling fins and a cover. The coolant may be dry air or fluid in order to reduce the amount of condensation forming on the cooling ring. The base of the cooling ring may be separated from the cover by an insulating ring. Preferably, no cooling fins are provided on the cover in order to reduce the amount of condensation forming on the cover. The insulating ring is preferably of comparable size to the base and preferably formed of Teflon. The provision of such an insulating ring reduces the amount of condensation that forms on the cooling ring without impacting cooling performance.

[0029]Accordingly, the present invention also provides a clamp for a DUT which overcomes this problem. The clamp has a very low profile which enables the heat spreader to move over a large area without colliding with the clamp in which the DUT is mounted. In particular, the clamp is provided so that its uppermost surface is flush with the DUT package surface. Typically silicon substrates are thinned to 100 μm for such analysis. Consequently the silicon substrate surface is positioned about 100 μm above the DUT package surface and, about 100 μm above the uppermost surface of the clamp.

Problems solved by technology

However, viewing through the diamond heat spreader with a SIL causes a substantial loss of image quality and significantly reduces the improvement in numerical aperture (NA).

Such a heat spreader can be used satisfactorily to analyse a 90 nm feature on a DUT but is incompatible with the optical characteristics of SILs required to resolve features on DUTs which have a higher resolution, e.g features of 65 nm and below that are currently being developed.

The use of a high pressure liquid to spray cool the device has limited thermal conductivity, especially near a SIL.

In addition, the method does not permit wide area imaging because the turbulent liquid present in the light path impairs the image quality acquired using air-gap lenses.

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