Thermal enhanced plastic ball grid array with heat sink attachment option

Abstract

A thermal enhanced structure comprising a packaged electronic device and a heat sink that is removably attached thereto. The thermal enhanced structure includes a plastic ball grid array (PGBA) with an electronic chip, a plastic mold cover, and a heat spreader with a plurality of spaced apart securing studs positioned and caulked at a periphery edge thereof. The mold cover, the heat spreader and studs are molded and embedded with one another to form a single unit with improved torque strength and heat dissipation. The single molded unit and the plastic ball grid array are secured together by an adhesive material. Then the heat sink can be easily and removably attached to the molded single unit by fastening elements to the molded studs, thereby allowing more efficient controllable forces or pressures to be applied as the mechanical fastening elements are removably attached to the molded studs to thereby prevent stress and damage to the PBGA package.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This is a continuation of co-pending application Ser. No. 12 / 039,555, filed Feb. 28, 2008.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to the assembling of heat sinks, thermal heat spreaders and electronic or integrated circuit device packaging. In particular, the present relates to a structure and method for removably attaching a heat sink to a heat spreader through stud elements disposed on a top surface of a plastic mold cover / lid disposed there between for receiving bolts, screws, rivets or other type of fasteners to an electronic laminate package, such as, a BGA (ball grid array) or PBGA (plastic ball grid array) to improve heat dissipation and controllable forces and pressures applied to the electronic laminate package.[0004]2. Description of the Related Art[0005]It is known that there has been rapid development in electronic or integrated circuit package technology and, as a result, the elect...

AI Technical Summary

Benefits of technology

"The patent describes an electronic package assembly that includes a heat spreader and a heat sink attached to a circuit board using a plastic or molded cover. The heat spreader is embedded in the cover, providing added strength for screw or mechanical fastening torque. The cover is secured to the heat spreader using various types of mechanical fasteners, reducing stress and pressure forces applied to the package components. The invention improves heat dissipation by enhancing the surface of the package. The structure is simple, allowing for easy application control and production in existing processes. No extra space is required for securing the thermal unit."

Problems solved by technology

It is known that there has been rapid development in electronic or integrated circuit package technology and, as a result, the electronic or integrated circuit package components are becoming smaller and circuitry within the electronic package components is becoming increasingly dense.

Thus, heat dissipation is becoming more critical as the technology develops.

A method of fixing the heat slag or the heat sink to a motherboard via a backing or support plate by studs, spacers and / or mechanical attachment devices, such as, bolts, pins, screws, rivets, and other types of mechanical attachment devices generates unwanted stress or forces that causes damage to the BGA or integrated circuit package.

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