Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

Inactive Publication Date: 2009-10-01
FAIRCHILD KOREA SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The present invention provides power device packages that include thermal electric modules using the Peltier eff

Problems solved by technology

Since the generated heat is generally discharged to the outside through a substrate, when a substrate, such as a ceramic su

Method used

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  • Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same
  • Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same
  • Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

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Embodiment Construction

[0038]Reference will now be made in detail to example embodiments, examples of which are illustrated in the accompanying drawings. However, example embodiments are not limited to the embodiments illustrated hereinafter, and the embodiments herein are rather introduced to provide easy and complete understanding of the scope and spirit of example embodiments. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

[0039]It will be understood that when an element, such as a layer, a region, or a substrate, is referred to as being “on”, “connected to” or “coupled to” another element, it may be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly on,”“directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. Like reference numerals refer to like elements throughout. As used herein, the term...

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Abstract

Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2008-0029311, filed on Mar. 28, 2008, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to power device packages and methods of fabricating the same, and more particularly, to power device packages, each of which includes a thermal electric module using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the power device packages.[0004]2. Description of the Related Art[0005]As the power electronic industry develops power devices, such as power transistors, insulated-gate bipolar transistors (IGBTs), MOS transistors, silicon-controlled rectifiers (SCRs), power rectifiers, servo drivers, power regula...

Claims

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Application Information

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IPC IPC(8): H01L23/34H01L21/50H01L21/56H01L23/495
CPCH01L23/3107H01L2924/13055H01L23/4334H01L23/49575H01L35/08H01L2224/48091H01L2224/73265H01L2924/01004H01L2924/01078H01L2924/01079H01L23/38H01L2924/19107H01L2224/48247H01L2224/48227H01L2224/32245H01L24/48H01L2924/13091H01L2224/45139H01L2924/1305H01L2924/13034H01L2224/32225H01L2924/00014H01L2924/00H01L2924/00012H01L2224/45124H01L2224/45144H01L24/45H01L24/73H01L2924/14H01L2924/181H10N10/817H01L2224/05599H01L2224/45015H01L2924/207H01L23/48H10N10/00
Inventor LIM, SEUNG-WONJEON, O-SOEBSON, JOON-SEOLEE, BYOUNG-OKJONG, MAN-KYO
Owner FAIRCHILD KOREA SEMICON
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