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High performance compact heat exchanger

Inactive Publication Date: 2010-02-18
RAYTHEON CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]It is a further object of this invention to provide such a heat exchanger which is compact.
[0009]It is a further object of this invention to provide a heat exchanger with improved thermal performance.
[0012]It is a further object of this invention to provide such a heat exchanger which can be manufactured at a reasonable cost.

Problems solved by technology

Although these specialized fins typically resulted in an increase air side pressure drop, the corresponding thermal conductance also increased.
One of the challenges is determining the optimum fin configuration (e.g., spacing, thickness, height, and the like).
In an active electronically scanned array (AESA) radar, high power, high density electronics are packed into tight arrays with extremely limited space for thermal management.

Method used

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Embodiment Construction

[0029]Aside from the preferred embodiment or embodiments disclosed below, this invention is capable of other embodiments and of being practiced or being carried out in various ways. Thus, it is to be understood that the invention is not limited in its application to the details of construction and the arrangements of components set forth in the following description or illustrated in the drawings. If only one embodiment is described herein, the claims hereof are not to be limited to that embodiment. Moreover, the claims hereof are not to be read restrictively unless there is clear and convincing evidence manifesting a certain exclusion, restriction, or disclaimer.

[0030]FIG. 1 shows an example of a prior art heat sink 10 with fins 12. A heat source such as electronic chip 14 on heat spreader 16 is cooled by heat sink 10. An active heat sink may include a fan to blow air over fins 12.

[0031]FIG. 2 shows an example of a high performance compact heat exchanger in accordance with the subj...

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Abstract

A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser.

Description

FIELD OF THE INVENTION[0001]The subject invention relates to methods for cooling heat sources such as radar arrays.BACKGROUND OF THE INVENTION[0002]A variety of heat sinks with different fin configurations are used to cool heat sources such as electronic chips. See U.S. Pat. Nos. 6,508,301 and 6,519,955 incorporated herein by this reference. The technique used for many decades to air cool one or more heat dissipating components was to place an extruded aluminum heat sink containing straight fins onto the device. In the prior art, the heat fluxes were low enough that natural convection along with the increase in surface area due to the fins sufficiently cooled the components. As the thermal challenges increased, active cooling using a fan in conjunction with the fin heat sink was needed. Additional optimizations included changing the shape of the fins to maximize the effective thermal conductance (a product of surface area and heat transfer coefficient) from the fins to the surroundi...

Claims

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Application Information

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IPC IPC(8): F28F7/00F24H3/02
CPCF24H3/022F28D1/0472F28D1/0473F28D7/04F28D15/0266F28F3/12H01L2924/0002H01L23/427H01L23/467F28F2215/06H01L2924/00
Inventor ELLSWORTH, JOSEPH R.CHEYNE, SCOTT R.NULL, MICHAEL E.MARTINEZ, MICHAEL P.ALTMAN, DAVID H.BURDI, ANTHONY J.
Owner RAYTHEON CO
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