Wiring board and method of fabricating the same

a technology of wiring board and insulator layer, which is applied in the direction of printed circuit aspects, conductive pattern formation, and semiconductor/solid-state device details, etc., can solve the problems of increasing the fabrication cost of the wiring board, affecting the further reduction of the thickness of the wiring board that is fabricated using the build-up, and the inability to suppress the insulator layer satisfactorily. , to achieve the effect of suppressing delamination and improving the reliability of the wiring board
US20100084163A1Inactive Publication Date: 2010-04-08SHINKO ELECTRIC IND CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SHINKO ELECTRIC IND CO LTD
Publication Date
2010-04-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of a Japanese Patent Application No. 2008-259016 filed on Oct. 3, 2008, in the Japanese Patent Office, the disclosure of which is hereby incorporated by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a wiring board having electrode pads, conductor patterns connected to the electrode pads and an insulator layer embedded with the electrodes and the conductor patterns, and to a method of fabricating such a wiring board.

[0004] 2. Description of the Related Art

[0005] Wiring boards having various shapes and structures have been proposed for use in mounting thereon electronic components such as semiconductor chips. Recently, there are increased demands to reduce the thickness and size of the wiring board mounted with the semiconductor chip, due to the reduced thickness and size of the semiconductor chip.

[0006] Known methods of forming thin wiring boards ...

Claims

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