Substrate processing apparatus, substrate processing method, and computer readable storage medium

Abstract

A substrate processing apparatus is disclosed for bringing a substrate from a carrier, by a substrate transfer portion inside a transfer chamber, into a processing module to perform a process therein. The substrate processing apparatus includes a substrate storing chamber coupled to an exterior of the transfer chamber via a transfer opening to be in communications with the transfer chamber; a first storing shelf in the substrate storing chamber to store substrates for a first storing purpose; a second storing shelf in the substrate storing chamber to store substrates for a second storing purpose different from the first storing purpose; and a shifting mechanism that shifts the first and the second storing shelves to position a substrate storing area of one of the first and the second storing shelves so that substrate transferring is enabled between the substrate storing area and the substrate transfer portion via the transfer opening.

Description

TECHNICAL FIELD[0001]The present invention relates to a substrate processing apparatus that carries out a substrate process in a processing module, and specifically to a technology for storing a wafer in the processing apparatus for different purposes.BACKGROUND ART[0002]In semiconductor device manufacturing, there is an operation in which a vacuum process such as an etching process and the like is carried out on a substrate to be processed, for example, a semiconductor wafer (referred to as a wafer, hereinafter). In order to carry out such a process at a high throughput, a vacuum processing apparatus called a multi-chamber system and the like is used.[0003]Among the vacuum processing apparatuses, one having a vacuum processing chamber and an atmospheric transfer chamber has been known. An example of such a vacuum processing apparatus is shown in FIG. 1. A vacuum processing apparatus 100 is composed of a load port 110 provided with a stage on which a carrier C such as a Front Openin...

AI Technical Summary

Benefits of technology

[0025]According to the present invention, plural kinds of substrate storage shelves to be used for different storing purposes are integrated into one unit and aggregated in one place, an access position of a substrate transfer portion is shared for each of the substrate storage shelves, and the substrate storage shelves are moved to be in the access position. Therefore, because one appropriate position of the unit is determined by taking into consideration moving areas of the substrate storing shelves, designing flexibility of a layout of a substrate processing apparatus is enhanced and the designing is easily carried out, compared with a case where different kinds of the substrate storing shelves are separately arranged in different places and independently coupled to a transfer chamber.

Problems solved by technology

When the processed wafer W is transferred back to the load port 110, there may be a problem of so-called cross-contamination in which reaction products on the processed wafer W react with moisture in the atmosphere to produce a gas and this gas may be condensed on an unprocessed wafer W, thereby causing device defects.

However, because the substrate processing apparatus 100 so configured requires installing spaces for the storages 113, 116 depending on kinds of the storages, and the installing spaces and the number of the wafers to be stored are restricted due to an access area of the transfer arm, flexibility in designing a layout of the apparatus is limited and a foot print may not be reduced.

However, Patent document 1 does not describe a technology for storing plural kinds of wafers in the apparatus, or address an apparatus layout problem.

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