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Fluid supply apparatus, fluid applying apparatus, and fluid supply method

a technology of fluid supply and fluid application, which is applied in the direction of water supply installation, soldering equipment, manufacturing tools, etc., can solve the problems of difficult miniaturization of the solder supply apparatus, and achieve the effect of reducing the pressure applied to the fluid in the container

Inactive Publication Date: 2011-02-03
JUKI AUTOMATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a fluid supply apparatus, a fluid applying apparatus, and a method for supplying fluid that can be miniaturized and reliably supplied. The apparatus includes a piston, a piston support portion, a container support portion, and a drive mechanism. The drive mechanism can be a motor or other small output device, making it easy to miniaturize the apparatus. The apparatus can be integrated with a movement mechanism that causes the fluid supply apparatus and the squeegee mechanism to move, further reducing the size of the apparatus. The apparatus can reliably supply fluid and adjust the discharge amount, making it suitable for various applications."

Problems solved by technology

To serve the need, a large drive mechanism that is provided with a motor or the like having a large output is used, which makes it difficult to miniaturize the solder supply apparatus.

Method used

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  • Fluid supply apparatus, fluid applying apparatus, and fluid supply method
  • Fluid supply apparatus, fluid applying apparatus, and fluid supply method
  • Fluid supply apparatus, fluid applying apparatus, and fluid supply method

Examples

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modified example

[0153]The present invention is not limited to the above embodiment, and can be variously changed without departing from the gist of the present invention.

[0154]For example, FIG. 18 is a perspective view showing a modified example of the drive mechanism 103 of the fluid applying apparatus 150. In the drive mechanism 103, the rotary drive pulley 125 and the driving pulley 123 provided to the rotary shaft of the motor are connected with each other through the belt 124. The rotary drive pulley 125 is constituted of a first pulley 125a and a second pulley 125b. The first pulley 125a and the driving pulley 123 are connected with each other through the belt 124. With this structure, the driving pulley 123 and the rotary drive pulley 125 are rotated in conjunction with each other.

[0155]The first pulley 125a and the second pulley 125b share a rotary shaft 127, and the rotary shaft 127 is connected to the container support portion 104. The cogs of the second pulley 125b and the cogs of the ve...

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Abstract

A fluid supply apparatus includes a piston, a piston support portion to support the piston, a container support portion capable of supporting a container in which a fluid is contained, and a drive mechanism. The drive mechanism drives at least one of the container support portion and the piston support portion in a direction in which the piston is inserted into the container at a time when supply of the fluid is performed and drives at least one of the container support portion and the piston support portion in a direction in which the piston is relatively removed from the container at a time when the supply of the fluid is stopped.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a fluid supply apparatus, a fluid applying apparatus, and a fluid supply method for supplying a fluid such as solder that is to be applied to a printed circuit board.[0003]2. Description of the Related Art[0004]In the past, there has been known a solder printer that applies solder paste to a land and the like of a printed circuit board to form a solder pattern. In the solder printer, a solder supply apparatus that supplies solder paste is incorporated. Such a solder supply apparatus is disclosed in Japanese Patent Application Laid-open No. 2004-306102 (hereinafter, referred to as Patent Document 1), for example (see, FIG. 2 and the like of Patent Document 1).[0005]In the solder supply apparatus disclosed in Patent Document 1, a supply assembly is used. The supply assembly is constituted of a supply container that contains solder, a supply container member that stores and fixes the supply...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): E03B5/00
CPCB23K3/0638H05K3/1233B41F15/42Y10T137/0318Y10T137/85978
Inventor WATANABE, AKIHIKONODA, TSUTOMU
Owner JUKI AUTOMATION SYST