Heat sink

Abstract

A heat sink comprises a fin of the heat sink and a cooling set located on the fin of the heat sink. The fin of the heat sink includes a heat conduction portion and a plurality of cooling sheets extended integrally from the heat conduction portion. The heat conduction portion is hollow to form a housing space with at least one opening. The cooling set includes a butting member and a bracing member that are held in the housing space through the opening. The bracing member supports the butting member in the housing space to butt the heat conduction portion. The housing space also holds a cooling liquid and is sealed by a lid on the opening. The integrated cooling sheets and heat conduction portion can improve cooling efficiency and rapidly conduct a greater amount of heat to perform cooling.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat sink and particularly to a heat sink installed on a heat source of an electronic device to disperse heat therefrom.BACKGROUND OF THE INVENTION[0002]Processing and operation speeds of devices in computer systems such as CPU and graphic cards increase constantly. Operation temperatures of electronic devices also are higher. How to effectively and quickly lower the operation temperatures of the electronic devices to maintain regular operation has become a focused issue in the industry.[0003]R.O.C. patent Nos. 1316384, M363615, 1312654 and 1309149 disclose various types of heat sinks. They commonly have fins of a heat sink and a heat conduction duct coupling thereto. The heat conduction duct is in contact with a heat source of an electronic device to transfer heat generated by the heat source to the fins of the heat sink to be dispersed. The heat conduction duct is drawn to form a negative pressure inside and filled wit...

AI Technical Summary

Benefits of technology

[0007]The primary object of the present invention is to solve the aforesaid disadvantage so that heat on the heat conduction duct can be directly conducted to the fins without going through the medium and also to reduce fabrication complexity of the capillary structure on the inner wall of the heat conduction duct.

[0009]Compared with the conventional techniques, the present invention provides many benefits, notably:

[0010]1. The butting member is in contact with and anchored on the heat conduction portion through the bracing member without additional process such as sintering or other means, hence production cost can be saved.

[0011]2. As the cooling sheets and the heat conduction portion are formed integrally, there is no medium interposed between them, hence heat on the heat conduction portion can be directly conducted to the cooling sheets to improve cooling efficiency.

Problems solved by technology

How to effectively and quickly lower the operation temperatures of the electronic devices to maintain regular operation has become a focused issue in the industry.

1. The capillary structure located on the inner wall of the heat conduction duct generally is formed by sintering, sand blasting or embedded internally. Fabrication is complex, and fabrication time and cost are higher.

2. The heat conduction duct and fins of the heat sink generally are bonded by soldering or insertion coupling. A medium is contained between materials, such as a solder required in the soldering, and air becomes the medium in the insertion coupling. As a result, heat resistance value increases between the heat conduction duct and the fins of the heat sink due to the medium, and heat conduction efficiency is lower or instantaneous heat absorption capability suffers.

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