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Submount, optical module provided therewith, and submount manufacturing method

a manufacturing method and optical module technology, applied in the field of submounts, can solve the problems of poor manufacturing efficiency and bad manufacturing process yield, and achieve the effects of high precision, good manufacturing efficiency and easy manufacturing

Inactive Publication Date: 2012-06-21
ADVANCED PHOTONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0059]According to the present invention, it is possible to provide a submount that is easy to manufacture and has good manufacturing efficiency.
[0060]Also, according to the present invention, it is possible to provide an optical module that uses this submount.
[0061]Further, according to the present invention, it is possible to provide a method for manufacturing this submount efficiently and with high precision.

Problems solved by technology

With an electrode 102 of this type of structure there is a possibility of rupture to this bend section, and there is a possibility that manufacturing process yield will become bad.
Also, in order to form this type of structure a comparatively complicated processes required, and there is a problem of poor manufacturing efficiency.

Method used

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  • Submount, optical module provided therewith, and submount manufacturing method
  • Submount, optical module provided therewith, and submount manufacturing method
  • Submount, optical module provided therewith, and submount manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0099]A submount of a first embodiment of the present invention, and an optical module using the submount, will be described based on the attached drawings FIG. 3-FIG. 9.

[0100]An optical module of this embodiment comprises a submount 1, a module substrate 2, and an IC 3 as key elements (refer to FIG. 7).

(Submount Structure)

[0101]The submount 1 of this embodiment mainly comprises a submount substrate 11, a first electrode layer 12, a second electrode layer 13, an optical element 14 and a sealing member 16 (refer to FIG. 3 and FIG. 4). Mention of the sealing member 16 is omitted from FIG. 3.

[0102]The submount substrate 11 comprises a surface (right side surface in FIG. 3) 111, and a side surface (upper surface in FIG. 3) 112 adjacent to this surface 111. It is preferable to use a high insulation property material such as glass epoxy or ceramic as the material for the submount substrate 11.

[0103]The first electrode layer 12 is formed by laminating on the surface 111 of the submount sub...

second embodiment

[0133]Next, a submount 21 of a second embodiment of the present invention will be described mainly with reference to FIG. 15 to FIG. 19. In the description of this embodiment, the same reference numerals will be used for elements that are basically common to structural elements of the previously described first embodiment, and cumbersome description will be avoided.

[0134]The submount substrate 11 of the second embodiment is further provided with a via 123, a heat dissipator 124, and an intermediate conductive body 125 (refer to FIG. 15 to FIG. 17). Specifically, the submount substrate 11 of the second embodiment is configured as a so-called multilayer substrate.

[0135]The heat dissipator 124 is arranged on a rear surface side (left side in FIG. 15) of the submount substrate 11, in a state exposed to the outside. The via 123 connects the second electrode layer 13, on which an optical element 14 has been arranged, and the heat dissipator 124. A material having good thermal conductivity...

third embodiment

[0139]A submount 31 of a third embodiment of the present invention, will be described mainly with reference to FIG. 20-FIG. 21. In the description of this embodiment, the same reference numerals will be used for elements that are basically common to structural elements of each of the previously described embodiments, and cumbersome description will be avoided.

[0140]The submount substrate 11 of the third, embodiment, similarly to the second embodiment, is a so-called multilayer substrate.

[0141]Also, with the third embodiment, in addition to the optical element 14, an IC 3 is further mounted on the surface of the second electrode layer 13 of the submount substrate 11. Specifically, with the above-described embodiment an IC 3 was mounted on the surface of the module substrate 2, but with this third embodiment the IC 3 is mounted on the submount substrate 11. Also, the IC 3 and the optical element 14 are sealed by the sealing member 16 (refer to FIG. 20) together with wiring for connect...

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Abstract

In order to simplify submount manufacture, and increase the manufacturing efficiency thereof, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large. This allows, for example, wire bonding using this side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Description

TECHNICAL FIELD[0001]The present invention relates to a submount that can be used to mount a component for carrying out reception or transmission of light on a substrate.BACKGROUND ART[0002]In patent publication 1 and patent publication 2 described below, there is disclosed a submount for an LED-array as a light emitting element. An outline of this structure will be described using FIG. 1 and FIG. 2.[0003]The submount 100 of this related art comprises a submount substrate 101, a wiring electrode 102, and a light emitting element electrode 103. The wiring electrode 102, as shown in FIG. 1, is formed across a surface (the right side surface in FIG. 1) and a side surface (upper surface in FIG. 1) of the submount substrate 101. Also, as shown in FIG. 2, a light emitting element 104 is mounted on the electrode 103.[0004]An example of an optical module using this type of submount 100 is shown in FIG. 2. With this example, the submount 100 is mounted on a module substrate 200. An IC 300 is...

Claims

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Application Information

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IPC IPC(8): H01L33/48H05K13/00H05K7/20H01L31/02H05K1/18H01S5/023
CPCG02B6/4201Y10T156/1082H01L33/486H01L33/54H01L33/62H01S5/02248H01S5/02284H01L2224/48137H01L25/0753Y10T156/1052H01S5/02236H01L2933/0033H01L2924/3011H01L31/0203H01L31/18H01L2224/48091H01L2924/00014H01L2924/00H01L2924/181H01L2224/73265H01L2924/19107G02B6/4257G02B6/4274H01S5/02325H01S5/02251H01S5/0233H01S5/023H01L2924/00012H01S5/0235
Inventor SONG, XUELIANGYIT, FOO CHEONGHORIGUCHI, KATSUMASAWANG, SHURONG
Owner ADVANCED PHOTONICS INC
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