Approach to intergrate schottky in mosfet

Abstract

An integrated structure combines field effect transistors and a Schottky diode. Trenches formed into a substrate composition extend along a depth of the substrate composition forming mesas therebetween. Each trench is filled with conductive material separated from the trench walls by dielectric material forming a gate region. Two first conductivity type body regions inside each mesa form wells partly into the depth of the substrate composition. An exposed portion of the substrate composition separates the body regions. Second conductivity type source regions inside each body region are adjacent to and on opposite sides of each well. Schottky barrier metal inside each well forms Schottky junctions at interfaces with exposed vertical sidewalls of the exposed portion of the substrate composition separating the body regions.

Description

FIELD OF INVENTION[0001]Embodiments of the present invention are related MOSFET devices and more specifically to a new approach for integrating a Schottky diode in a MOSFET device.BACKGROUND OF INVENTION[0002]Schottky diodes have been used to replace P-N junction diodes in many applications. In particular, Schottky diodes have been used to replace P-N junction diodes in power MOSFETs (i.e., MOSFET with body diode in parallel with source and drain). Power MOSFETs that implement P-N junction diodes exhibit several undesirable characteristics, which include: large forward conduction loss, storage of charge between body-epitaxial junction when operating in forward bias, excess stored minority charges which cause large recovery currents and voltage overshoots when the power MOSFET is switched from forward bias to reverse bias, generation of radio frequency interference during fast switching. All of these characteristics cause unnecessary stress to the device, leading to sub-optimal perfo...

AI Technical Summary

Problems solved by technology

Power MOSFETs that implement P-N junction diodes exhibit several undesirable characteristics, which include: large forward conduction loss, storage of charge between body-epitaxial junction when operating in forward bias, excess stored minority charges which cause large recovery currents and voltage overshoots when the power MOSFET is switched from forward bias to reverse bias, generation of radio frequency interference during fast switching.

All of these characteristics cause unnecessary stress to the device, leading to sub-optimal performance.

The low forward drop of the Schottky diode during forward conduction reduces power dissipation of the device and leads to lower conduction loss.

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