Compositions and processes for producing compositions for removing conductive material, such as copper or copper alloys, from a substrate with reduced dishing and reduced insensitivity to overpolishing are provided. Embodiments include polishing compositions for electrochemical mechanical polishing of a substrate surface comprising a conductive material, the compositions having a pH of between about 3.0 to about 9.0, such as between about 4.0 to about 7.0, for example between about 5.0 to about 6.5. The polishing compositions comprise one or more inorganic based electrolytes, such as potassium phosphate monobasic, one or more chelating agents, such as citric acid, imidodiacetic acid, glycine, or salts thereof, such as ammonium citrate, one or more corrosion inhibitors, such as benzotriazole, a basic pH adjusting agent, such as ammonium hydroxide, potassium hydroxide or combinations thereof, one or more oxidizers, such as hydrogen peroxide or ammonium persulphate (APS), and a solvent, such as deionized water.