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96 results about "Substrate composition" patented technology

Packaging shell and preparation method based on lcp substrate

The invention provides a packaging shell based on an LCP substrate. The packaging shell comprises a lamination structure formed by laminating multiple LCP substrate composition layers; adjacent LCP substrate composition layers are combined through intermediate bonding layers; each LCP substrate composition layer comprises a bottom bonding pad layer located on the bottommost layer of the lamination structure, a chip mounting layer located in the middle of the lamination structure, a sealing layer located on the top layer of the lamination structure and a keying layer under the sealing layer; each LCP substrate composition layer further comprises at least one wiring interconnection layer arranged between the bottom bonding pad layer and the chip mounting layer and at least one wiring interconnection layer arranged between the keying layer and the chip mounting layer; all the layers of the lamination structure are electrically connected through via holes; each chip mounting layer is provided with a chip adhesion region, the positions, corresponding to the chip adhesion regions, of all the other layers above the chip mounting layers are provided with openings, and all the layers are stacked together to form a cavity used for containing a chip. The packaging shell has excellent high-frequency characteristics and air tightness.
Owner:WUXI ZHONGWEI GAOKE ELECTRONICS

A method of simultaneously measuring contents of Al, Cu, Mn, P and Si in ferrotitanium by utilizing an inductively coupled plasma emission spectrometer

A method of simultaneously measuring contents of Al, Cu, Mn, P and Si in ferrotitanium by utilizing an inductively coupled plasma emission spectrometer is provided. The method includes (1) a step of preparing a test sample solution, (2) a step of selecting element spectral lines, namely a step of selecting the optimum spectral line of each element according to substrate composition of a test sample, (3) a step of mapping standard curves, namely a step of preparing standard solutions of the Al, the Cu, the Mn, the P and the Si, measuring emission light intensity of each element under the optimum spectral line by utilizing the inductively coupled plasma emission spectrometer, and mapping the standard curves, and (4) a step of detecting the test sample, namely a step of introducing the test sample solution to the inductively coupled plasma emission spectrometer through a feeding system, measuring emission light intensity corresponding to each element, and determining the content of each element according to a corresponding standard curve. The linear relations of the standard curves obtained by the method are good, measurement of contents of the elements is high in accuracy and precision, and the method can be used for analyzing standard samples and production test samples.
Owner:CHENGDE JIANLONG SPECIAL STEEL

Packaging shell based on LCP substrate and preparation method thereof

The invention provides a packaging shell based on an LCP substrate. The packaging shell comprises a lamination structure formed by laminating multiple LCP substrate composition layers; adjacent LCP substrate composition layers are combined through intermediate bonding layers; each LCP substrate composition layer comprises a bottom bonding pad layer located on the bottommost layer of the lamination structure, a chip mounting layer located in the middle of the lamination structure, a sealing layer located on the top layer of the lamination structure and a keying layer under the sealing layer; each LCP substrate composition layer further comprises at least one wiring interconnection layer arranged between the bottom bonding pad layer and the chip mounting layer and at least one wiring interconnection layer arranged between the keying layer and the chip mounting layer; all the layers of the lamination structure are electrically connected through via holes; each chip mounting layer is provided with a chip adhesion region, the positions, corresponding to the chip adhesion regions, of all the other layers above the chip mounting layers are provided with openings, and all the layers are stacked together to form a cavity used for containing a chip. The packaging shell has excellent high-frequency characteristics and air tightness.
Owner:WUXI ZHONGWEI GAOKE ELECTRONICS
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