The purpose of the present invention is to provide a thermosetting
maleimide resin composition which has a cured product that has a high
glass transition temperature (Tg), excellent
dielectric properties, excellent adhesion to a
metal foil, and good intermiscibility, and which is uniformly hardened without causing uneven hardening during hardening. A thermosetting
maleimide resin composition containing (I) a bismaleimide compound and (II) a reaction accelerator, wherein the bismaleimide compound (I) is obtained by reacting an
aromatic diamine (A) represented by formula (1), a tetrabasic acid dianhydride (C), and
maleic anhydride, and has a cyclic
imide bond. In formula (1), R1 each independently represents a
hydrogen atom, a linear or branched
alkyl group having 1 to 6 carbon atoms, a
halogen atom, a hydroxyl group, or a linear or branched
alkoxy group having 1 to 6 carbon atoms. And l each independently represents an integer of 1 to 4.