Flexible fiber to wafer interface

a flexible fiber and wafer technology, applied in the direction of optical elements, manufacturing tools, instruments, etc., can solve the problems of inefficiency and cost of manufacture of the previous method and device for connecting optical devices to wafer devices
US20130251304A1Active Publication Date: 2013-09-26GLOBALFOUNDRIES US INC
6 Cites 26 Cited by

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
GLOBALFOUNDRIES US INC
Publication Date
2013-09-26

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

An interface device includes a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a first engagement feature operative to engage a portion of a wafer, and a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule.
Need to check novelty before this filing date? Find Prior Art

Description

FIELD OF INVENTION

[0001] The present invention relates generally to optical signal connection devices, and more specifically, to interfaces between optical fibers and devices arranged on wafers.DESCRIPTION OF RELATED ART

[0002] Optical signals may be transmitted via optical fibers. It is often desirable to connect the optical fibers to devices such as, for example, wave guides or signal processing features that may be arranged on a wafer such as, for example, a semiconductive wafer. Previous methods and devices for connecting optical devices to devices on wafers are often inefficient and costly to manufacture.BRIEF SUMMARY

[0003] According to one embodiment of the present invention, an interface device includes a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a first engagement feature operative to engage a portion...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More