Electroplating processor with geometric electrolyte flow path

Abstract

An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

Description

PRIORITY CLAIM[0001]This Application is a Divisional of U.S. patent application Ser. No. 13 / 468,273, filed May 10, 2012, now pending and incorporated herein by reference.FIELD OF THE INVENTION[0002]The field of the invention is chambers, systems, and methods for electrochemically processing semiconductor material wafers and similar substrates having micro-scale devices integrated in and / or on the work piece.BACKGROUND OF THE INVENTION[0003]Microelectronic devices are generally fabricated on and / or in wafers or similar substrates. In a typical fabrication process, an electroplating processor applies one or more layers of conductive materials, typically a metals, onto the substrate. The substrate is then typically subject to etching and / or polishing procedures (e.g., planarization) to remove a portion of the deposited conductive layers, to form contacts and / or conductive lines. Plating in packaging applications may be performed through a photoresist or similar type of mask. After plat...

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