X-ray sensor and method of manufacturing the same
a technology of x-ray sensor and manufacturing method, which is applied in the field of x-ray sensor, can solve the problems of difficult to achieve large-area deposition and inefficient cost and time, and achieve the effect of effectively coping with manufacturing large-area deposition, enhancing bonding strength and fatigue life of the bonding portion, and increasing photoelectric conversion efficiency
Active Publication Date: 2015-04-02
RAYENCE +1
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Benefits of technology
The present invention provides an X-ray sensor and a method of manufacturing the same, which solves issues with a direct deposition process. A separate substrate is used for forming the photoconductive layer, allowing for better film formation temperature and larger-area deposition. The two substrates are bonded using a curing material, enhancing bonding strength and fatigue life without the need for additional conductive adhesion or bumps. The PIN diode structure is formed through a rapid thermal treatment, resulting in increased photoelectric conversion efficiency and decreased leakage current.
Problems solved by technology
Typically, medical or industrial X-ray imaging has been performed using films and screens, but is inefficient in terms of cost and time due to the problems of development and storage of the films used.
However, such a direct deposition process is problematic because limitations are imposed on heat resistance of the layers of the array substrate and thus the film formation temperature of the photoconductor is restricted and it is difficult to achieve large-area deposition.
Method used
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[0027]Hereinafter, a detailed description will be given of embodiments of the present invention with reference to the appended drawings.
[0028]FIG. 1 is a cross-sectional view schematically illustrating an X-ray sensor according to an embodiment of the present invention.
[0029]As illustrated in FIG. 1, the X-ray sensor 10 according to an embodiment of the present invention may include a photoconductive substrate 100 having a photoconductive layer 130, and an array substrate 200 having driving elements and pixel electrodes 230.
[0030]The array substrate 200 and the photoconductive substrate 100 are separately manufactured and then bonded to each other by a bonding material 240.
[0031]The array substrate 200 includes signal wires (not shown) and driving elements (not shown) for reading out an electrical signal photoelectrically converted by the photoconductive layer 130. An example of the array substrate 200 may include a TFT substrate or a CMOS substrate. A CMOS substrate is exemplified ...
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This invention relates to a direct conversion X-ray sensor and to a method of manufacturing the same. This X-ray sensor includes an array substrate including a pixel electrode formed so as to protrude from a surface thereof at a pixel region; a photoconductive substrate including an upper electrode, and a photoconductive layer formed on a surface of the upper electrode so as to be in contact with the pixel electrode and having a PIN diode structure; and a bonding material filling a space around a contact region of the pixel electrode and the photoconductive layer so as to bond the array substrate and the photoconductive substrate.
Description
BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an X-ray sensor, and more particularly, to a direct conversion X-ray sensor and a method of manufacturing the same.[0003]2. Description of the Related Art[0004]Typically, medical or industrial X-ray imaging has been performed using films and screens, but is inefficient in terms of cost and time due to the problems of development and storage of the films used.[0005]To solve such problems, thorough research into an imaging system using a digital X-ray sensor is ongoing.[0006]An X-ray sensor may include a direct conversion X-ray sensor and an indirect conversion X-ray sensor. A direct conversion X-ray sensor directly converts X-rays into an electrical signal using a photoconductor, and an indirect conversion X-ray sensor converts X-rays into visible light by a scintillator so that the visible light is converted into an electrical signal using a photovoltaic device.[0007]Compared to an indir...
Claims
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IPC IPC(8): H01L27/146
CPCH01L27/14659H01L27/1469H01L27/14634H01L27/14661H01L27/14676H01L27/14694H01L27/14696H01L27/14698Y02E10/50H01L31/04H01L31/02963H01L31/03042H01L31/1828H01L31/184H01L31/1864
Inventor HEO, SUNG KYNLEE, HO SEOK
Owner RAYENCE