Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

a technology of resin composition and resin composition, which is applied in the direction of synthetic resin layered products, thermoplastic polymer dielectrics, metal layered products, etc., can solve the problems of lowering of resin composition cutting properties, and insufficient lowering of drilling processability of laminate plates using resin compositions, etc., to achieve excellent drilling processability and heat resistance, and low thermal expansion properties. , the effect of excellent performan

Inactive Publication Date: 2016-08-11
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0027]The thermosetting resin composition of the present invention is especially low in thermal expansion properties and excellent in drilling processability and heat resistance and is suitably used for electronic components, etc.
[0028]For that reason, according to the present invention, a prepreg and a laminate plate each having an excellent performance, and so on can be provided by using the subject thermosetting resin composition.
[0019]Under such circumstances, the present invention has been made. A first object of the present invention is to provide a thermoplastic resin composition which is especially low in thermal expansion properties and excellent in drilling processability and heat resistance and which is suitably used for electronic components, etc., and a prepreg and a laminate plate each using the same; and a second object thereof is to provide a laminate plate for wiring boards, which is very excellent in drilling processability at the time of fabricating a wiring board and which also has favorable electrical insulating properties and low thermal expansion properties.
[0030]Furthermore, according to the present invention, a method for manufacturing a resin composition varnish, in which precipitation or aggregation of a molybdenum compound hardly occurs, and a prepreg and a laminate plate each having a low coefficient of thermal expansion and high drilling processability can be provided.

Problems solved by technology

But, the use of a cyanate resin or the filling of an inorganic filler in a high density involved such a problem that cutting properties of the resin composition are lowered, thereby significantly impairing drilling processability of a laminate plate using such a resin composition.
However, there were such inconveniences that the effect for preventing a lowering of the drilling processability is insufficient; the resin composition becomes low in elasticity, so that the effect for suppressing a warp of the semiconductor package is insufficient; and so on.
Thus, satisfactory results have not been obtained yet.
But, if the content of a hard filler such as silica is increased, there was encountered such a problem that the drilling processability of the laminate plate is lowered.
But, if molybdenum disulfide is added, there is encountered such a problem that electrical insulating properties of the laminate plate are significantly lowered.
Thus, satisfactory results have not been obtained yet.
But, since the molybdenum compound has a large specific gravity, when added directly to a resin composition varnish to be used for the fabrication of a laminate plate, it easily precipitates to cause defective manufacture.
However, there are such drawbacks that the resin composition varnish is thickened; aggregation of the molybdenum compound-supported particles with each other easily occurs; and so on.
Thus, satisfactory results are not obtained.

Method used

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  • Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
  • Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
  • Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Examples

Experimental program
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Effect test

manufacturing example 1

Manufacture of Maleimide Compound (A-1)

[0164]In a reaction vessel having a capacity of 2 liters and capable of being heated and cooled, which was equipped with a thermometer, an agitator, and a reflux condenser-equipped water quantity meter, 358.0 g of bis(4-maleimidophenyl)methane, 54.5 g of p-aminophenol, and 412.5 g of propylene glycol monomethyl ether were charged and allowed to react with each other for 5 hours while refluxing, thereby obtaining a maleimide compound (A-1).

manufacturing example 2

Manufacture of Maleimide Compound (A-2)

[0165]In a reaction vessel having a capacity of 2 liters and capable of being heated and cooled, which was equipped with a thermometer, an agitator, and a reflux condenser-equipped water quantity meter, 358.0 g of bis(4-maleimidophenyl) methane, 68.5 g of p-aminobenzoic acid, and 322.5 g of N-dimethylacetamide were charged and allowed to react with each other at 140° C. for 5 hours, thereby obtaining a maleimide compound (A-2).

examples 1 to 3

[0166]The unsaturated maleimide compound (A) having an acidic substituent obtained in Manufacturing Example 1 or 2, and (B) a thermosetting resin and a curing accelerator, (C) an inorganic filler, and (D) a molybdenum compound as described below were dispersed and dissolved in a blending proportion shown in Table 1 in propylene glycol monomethyl ether, thereby obtaining a homogeneous varnish having a content of the resin composition of 70% by mass. This resin composition varnish was impregnated and coated on an E-glass cloth [WEA116E, manufactured by Nitto Boseki Co., Ltd.] having a thickness of 0.1 mm, followed by heating for drying at 150° C. for 5 minutes to obtain a prepreg having a content of the resin composition of 50% by mass. Four sheets of this prepreg were superimposed, and an 18 μm-thick electrolytic copper foil was disposed on the top and bottom, followed by vacuum pressing under a pressure of 3.5 MPa at a temperature of 185° C. for 90 minutes, thereby obtaining a coppe...

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Abstract

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This is a U.S. Divisional application of U.S. application Ser. No. 13 / 518,578 filed Jun. 22, 2012, which is a U.S. national phase application filed under 35 U.S.C. §371 of International Application No. PCT / JP2010 / 073376, filed Dec. 24, 2010, designating the United States, which claims priority from Japanese Patent Applications 2010-165556 filed Jul. 23, 2010, 2010-160979 filed Jul. 15, 2010, and 2009-296058 filed Dec. 25, 2009, the contents of each of which are hereby incorporated herein by reference in their entirety for all purposes.TECHNICAL FIELD[0002]The present invention relates to a thermosetting resin composition which is especially low in thermal expansion properties and excellent in drilling processability and heat resistance and which is suitably used for electronic components, etc.; a prepreg and a laminate plate each using the same; a laminate plate for wiring boards requiring a drilling processing treatment at a manufacturin...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09D163/04C08K5/3415C09D7/12C08K3/22C08K3/34C08K13/02C09D163/00C08K3/36C09D7/61C09D7/63
CPCB32B15/08C09D7/1216B32B27/18C08J5/24C08J2300/24C08J2363/00C08L63/00H05K1/0366H05K1/0373H05K2201/0209B32B27/04H05K2201/0129C08K3/0033C08K3/36C08K5/3415C08K2003/2255Y10T428/31678Y10T428/31529Y10T156/10C08K2003/2296C08K2003/2227C08K2003/2206C09D163/04C08K3/34C08K3/22C09D163/00C09D7/1233C08K13/02H05K1/0306H05K3/0047C09D7/61C09D7/63C08K3/013C08J5/244C08J5/249
Inventor TAKAHASHI, YOSHIHIROKAMIGATA, YASUOMURAI, HIKARIAOSHIMA, MASAHIROTSUCHIKAWA, SHINJIMIYATAKE, MASATOKOTAKE, TOMOHIKOIZUMI, HIROYUKI
Owner RESONAC CORPORATION
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