Semiconductor device, semiconductor chip, and test method for semiconductor chip
a semiconductor chip and semiconductor technology, applied in the field of semiconductor devices, can solve the problems of increasing the size of the semiconductor device, reducing the area that could be taken up by circuitry for primary functions, etc., and achieve the effect of increasing the size of the devi
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embodiment 1
[0032]FIG. 1 is a circuit diagram showing an example of a circuit formed in a semiconductor chip 10 after manufacturing. As shown in FIG. 1, the semiconductor chip 10 has formed therein a signal processing circuit MC, output buffers B1 to Bn (n being an integer of 2 or greater), a testing circuit TC, and output pads OT1 to OTn.
[0033]The signal processing circuit MC is configured to supply to the output buffers B1 to Bn data signals D1 to Dn generated by performing a signal process (explanation omitted) required for the semiconductor chip 10.
[0034]The output buffers B1 to Bn are configured to supply, to the testing circuit TC through lines L1 to Ln, output data signals DD1 to DDn generated by individually amplifying the data signals D1 to Dn by a gain of 1, for example. Among the lines L1 to Ln, the lines L2 to Ln are individually connected to the output pads OT2 to OTn of the semiconductor chip 10.
[0035]The testing circuit TC has switch elements SW1 to SWn provided for each of the b...
embodiment 2
[0058]FIG. 5 is a circuit diagram showing a circuit according to Embodiment 2 formed in a semiconductor chip 10 after manufacturing. The configuration shown in FIG. 5 is similar to that of FIG. 1 except that a testing control unit TCUa is used instead of the testing control unit TCU shown in FIG. 1, a switch element SWx is additionally provided as a common output switch, and a switch element SWy is additionally provided as a grounding switch.
[0059]The switch element SWx configured to be set on or off according to a switching signal Sx. When the switch element SWx is set to be on, the output line QL and the common output line TL are connected. On the other hand, when the switch element SWx is set to be off, the output line QL is disconnected from the common output line TL. It is preferable that the switch element SWx be formed in the vicinity of the output line QL.
[0060]The switch element SWy is configured to be set on or off according to a switching signal Sy. In this case, when the...
embodiment 3
[0066]FIG. 7 is a circuit diagram showing a circuit according to Embodiment 3 formed in a semiconductor chip 10 after manufacturing. The configuration shown in FIG. 7 is the same as that of FIG. 1 except that shorting pads P2T to PnT for connecting the shorting wiring line are each formed in the lines L2 to Ln. In this case, it is preferable that the shorting pads P2T to PnT be disposed in a position such that the length of the line L(t) from the output terminal of the output buffer B(t) (t being an integer of 2 to n) to the shorting pad P(t)T is equal to the length of the line L1 from the output terminal of the output buffer B1 to the shorting pad P1T.
[0067]Even when the configuration shown in FIG. 7 is adopted for the testing circuit TC, testing of the semiconductor chip 10 is performed according to the system configuration shown in FIG. 2 in a manner similar to the configuration shown in FIG. 1. In this case, the test operation for when the configuration shown in FIG. 7 is adopte...
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