System, a tangent probe card and a probe head assembly for testing semiconductor wafter

Abstract

A system for semiconductor wafer testing, a tangent probe card and a probe head assembly thereof. The system has a tangent probe card and a tester. Testing ends of the probe card are flat, hence the allowable alignment budget will always be more generous for the tangent probe card. The probes are held on the probe head assembly, and once the alignment is achieved accurately during manufacture, the alignment will remain stable throughout the whole life cycle. The probe has a greater CCC due to its larger cross section. The throughput of the tangent probes is higher than that of the conventional probe card since there is no need to move the pointed pin / structure. No pointed pin / structure needs to be repaired, and the flat bottom surface of the probe head assembly is easier to clean and maintain.

Description

FIELD OF THE UTILITY MODEL[0001]The utility model relates to the technical field of semiconductor testing, and particularly, relates to a system for semiconductor wafer testing, a tangent probe card and a probe head assembly thereof.BACKGROUND OF THE UTILITY MODEL[0002]It is traditional, in the technical field of semiconductor wafer testing, to utilize a probe card as an interface between a tester and a semiconductor wafer. As shown in FIG. 1, traditional probe cards, such as cantilever-type probe cards, vertical probe cards, or MEMS (micro-electro-mechanical system) probe cards, usually contact the surface of a wafer 40 via a pointed pin / structure (as a pointed probe 110′ in FIG. 1). In testing semiconductor wafer, the contact surface of the wafer may be solder bump, Cu pillar, and Si through-holes. With the development of the treatment technologies of wafer, the wafer contact surface will become smaller and smaller. For example, the diameter of the Cu pillar will decrease from 70 ...

AI Technical Summary

Benefits of technology

The system, probe card, and probe head assembly described in this patent have several advantages.1) The tangent probes are held securely on the probe head, ensuring accurate alignment during manufacture and stability throughout the lifetime of the system.2) The throughput of the tangent probe card is higher than traditional vertical or MEMS probe cards, as there is no need to move the pointed pin / structure.3) The flat bottom surface of the probe head makes it easier to clean and maintain, reducing the frequency of maintenance and repair.

Problems solved by technology

This confronts the traditional testing methods with many challenges, such as:alignment of the probe tip with the test target.

For example, if the probe tip 111′ fails to reach the top center of the Cu pillar 400 during touchdown, the resulting shear force applied onto the stress point may create fracture to the pillar.

When the diameter of the probe is decreased, the probe will be weakened and become more subjected to deform during probing.

A poor alignment will directly affect the performance of the probe card.current carrying capability of the probe.

Generally, it is more laborious to handle a finer probe tip and may be likely to increase the manufacturing time.maintenance and repair of the probe.

A finer probe is more prone to breakdown during handling and probing, such that the frequency of maintenance and repair will be increased.

Images