Unlock instant, AI-driven research and patent intelligence for your innovation.

Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof

a technology of capillary flow and compositions, applied in the direction of radiation-absorbing paints, electrically conductive paints, coatings, etc., can solve the problems of high cost, low uph, laborious substrate masking, etc., and achieve the effect of improving emi shielding performan

Active Publication Date: 2019-03-28
HENKEL KGAA
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides better conductive materials for coating surfaces to reduce EMI (Electro Magnetic Interference) shielding. The new materials have higher conductivity and can be applied at a thin coating thickness, making them more effective than previous methods. This allows for improved performance even at very small gaps between surfaces.

Problems solved by technology

However, these methods require pre-treatment of the surface to be coated and require laborious masking of the substrate.
However, such methods require the use of very expensive equipment; moreover, its UPH is very low.
Unfortunately, however, when the paste adhesive doesn't have high electrical conductivity, very thick films are needed in order to achieve the desired shielding performance.
A limitation of this method is that the EMI shielding effectiveness is not as good as pure metal sheet or metal coatings provided by plating and sputtering (due to the inferior electrical conductivity of the conductive coatings).
Another limitation is that it is difficult to produce a uniform, three-dimensional thin coating on an electronic package by regular spray or printing processes.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof
  • Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof
  • Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0174]The following exemplary formulation is prepared by combining the following components:

[0175]Sample 1

Celloxide 2021P (epoxy)5.71Epiclon EXA 830 CRP (epoxy)1.90Ricon 130 MA 20 (rubber)4.35Silane A 186 (silane)0.27Sartomer SR 285 (diluent)5.00Imicure HAPI (solid) (Curing agent)0.76FA-FAB-23882.00Subtotal (g)100.00

[0176]The filler (FA-FAB-238) is characterized as follows:

FA-FAB-238Particle sizeDmax9.3D903.7D502.1D100.9Specific surface area0.9 m{circumflex over ( )}2 / gTap density5.1 g / cm{circumflex over ( )}3

[0177]The resulting formulation flows smoothly into the gap when applied to a substrate having a gap therein (see, for example, FIGS. 1A-1C and 2A-2C).

example 2

[0178]Another exemplary formulation is prepared by combining the following components:

[0179]Sample 2

Celloxide 2021P (epoxy)5.71Epiclon EXA 830 CRP (epoxy)1.90Ricon 130 MA 20 (rubber)4.35Silane A 186 (silane)0.27Sartomer SR 285 (diluent)5.00Imicure HAPI (solid) (Curing agent)0.76AgCu 020482.00Subtotal (g)100.00

[0180]The filler (AgCu-0204) is characterized as follows:

AgCu 0204Particle sizeDmax9.3D905.05D503.04D101.88Specific surface area0.38 m{circumflex over ( )}2 / gTap density 4.6 g / cm{circumflex over ( )}3

[0181]The resulting formulation flows smoothly into the gap when applied to a substrate having a gap therein (see, for example, FIGS. 1A-1C and 2A-2C).

example 3

[0182]Another exemplary formulation is prepared by combining the following components:

[0183]Sample 3

Nano silver with 90 nm diameter (85 wt %95in diethylene glycol mono-n-butyl ether)Butyl acetate5Total100

[0184]The resulting formulation flows smoothly into the gap when applied to a substrate having a gap therein (see, for example, FIGS. 1A-1C and 2A-2C).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Login to View More

Abstract

Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.

Description

FIELD OF THE INVENTION[0001]The present invention relates to methods for filling gaps in, and providing EMI (electromagnetic interference) shielding to, electronic packages. The present invention also relates to compositions useful in such methods. In another aspect, the present invention also relates to articles prepared using invention formulations and methods.BACKGROUND OF THE INVENTION[0002]EMI shielding is the practice of reducing the electromagnetic field in a space by blocking the field with barriers made of conductive or magnetic materials. Shielding is typically applied to enclosures to isolate electrical devices from the ‘outside world’. Electromagnetic shielding that blocks radio frequency electromagnetic radiation is also known as RF shielding.[0003]EMI shielding can reduce the coupling of radio waves, electromagnetic fields and electrostatic fields. A conductive enclosure used to block electrostatic fields is also known as a Faraday cage. The amount of reduction one can...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/552H01L21/3205H01L21/56H01B1/22C09D163/00C09D5/24C09D5/32C09D7/40
CPCH01L23/552H01L21/32056H01L21/56H01B1/22C09D163/00C09D5/24C09D5/32C09D7/67C09D7/68C09D7/69C08L2203/20C08L2205/025C08L2205/03C08K2201/001C08K2003/0806C09D4/00C08K2201/005C09D7/61H05K9/0015C08L63/00C08L13/00C08L33/14C08K3/08C08K5/5419C08K3/013C08K5/0025H05K9/0081
Inventor HONG, XUANCAO, XINPEIWYATT, DEREKZHUO, QIZHUOHOANG, ELIZABETH
Owner HENKEL KGAA