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Additive phosphorus-containing polysiloxane compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom

Inactive Publication Date: 2020-09-17
ICL IP AMERICA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes the discovery that adding a specific group of molecules to silica can make it more rigid and prevent the formation of flexible cage structures. This results in a polysiloxane with better insulation properties. Surprisingly, the invented polysiloxane also works as a flame retardant for electronic materials. The patent describes a flame retardant composition made of a thermosetting resin and a phosphorus-containing polysiloxane flame retardant. The phosphorus-containing polysiloxane flame retardant has a specific structure and is made by combining alkyl groups and phosphorus-based molecules. Overall, this patent provides a new way to make polysiloxane with improved properties and a better understanding of how it works as a flame retardant.

Problems solved by technology

In addition, the bridging / crosslinking group maintains the loose packing structure containing some free volume, leading to a superb dielectric constant and loss factor.

Method used

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  • Additive phosphorus-containing polysiloxane compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom
  • Additive phosphorus-containing polysiloxane compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom
  • Additive phosphorus-containing polysiloxane compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom

Examples

Experimental program
Comparison scheme
Effect test

example 1

of DOPO-Siloxane

[0078]10-(2-trimethoxysilyl-ethyl)-9-hydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO-H) (432.4 g, 2.0 mol) and vinyltriethoxysilane (VTES) (399.7 g, 2.1 mol) were mixed together. The suspension was heated to 120° C. and formed a heterogeneous solution (molten DOPO—H layer on the bottom). t-Butyl peroxide (4 mL) was added dropwise into the reaction mixture within 30 min, tiny bubbles generated when peroxide reached the solution, and a homogeneous solution formed in a short time. The mixture was stirred at 120° C. for another 2 hours. At the end of the reaction, 31P NMR showed that less than 1 mol % of DOPO-H was left. The product DOPO-triethoxysilane (DOPO-TES) is a clear liquid. 31P NMR (121 MHz, CDCl3, ppm) δ 40. 1H NMR (300 MHz, CDCl3, ppm) δ 7.0-8.0 (m, 8H), 3.3-3.5 (m, 9H), 1.8-2.3 (m, 2H), 0.6-1.1 (m, 2H).

[0079]3.3 g of methanol, 0.6 g of water and 2.0 g of acetic acid were mixed together and added into 12 g of DOPO-TES dropwise over 15 min at 0° C. The reacti...

example 2

of DOPO-Siloxane

[0080]DOPO-Siloxane was prepared using procedures in Example 1. The product was then heated at 165° C. for 2 h to fully react any left-over Si—OH groups. After heating, the TGA 95 wt % is at 359° C.

example 3

of DOPO-Vinyl-Siloxane

[0081]DOPO-TES was prepared using procedures in Example 1. 3.3 g of methanol, 0.6 g of water and 2 g of acetic acid were mixed together and added into a mixture of 10 g of DOPO-TES and 1.3 g of VTES dropwise over 15 min at 0° C. The reaction mixture was stirred at 100° C. for 4 hours. The solvent was removed and the product is a white foam. 31P NMR (121 MHz, CDCl3, ppm) δ 37-42 (product). 1H NMR (300 MHz, CDCl3, ppm) δ 7.0-8.0 (m, 8H), 5.3-6.0 (m, 1.8), 1.8-2.3 (m, 2H), 0.6-1.1 (m, 2H). The ratio between DOPO- and vinyl-groups is determined to be 5:3 based on the proton NMR. The product was then heated at 150° C. for 2 h to fully react any left-over Si—OH groups. After heating, the TGA 95 wt. % is at 318° C.

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Abstract

There is provided herein a flame retardant composition containing a thermosetting resin and a phosphorus-containing polysiloxane flame retardant, which flame retardant composition can be used in prepregs, laminate, bonding sheets and printed wiring boards.

Description

[0001]This application claims priority to U.S. Provisional Application No. 62 / 595,334 filed on Dec. 6, 2017, the entire contents of which are incorporate herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to the field of flame retardants, specifically phosphorus-containing flame retardants for electronic applications such as printed circuit boards.BACKGROUND OF THE INVENTION[0003]The rapidly developing electronics industry, especially that of consumer electronics, is in need of products that have light weight, high density, high reliability, high functionality, and low power consumption. This requires electronic components to have higher signal transmission speed and transmission efficiency, with high signal integrity and very low power loss. This requires dramatic improvement in the performance of printed circuit board carriers. In addition, the high speed and multi-functionalization of electronic products requires improvement in dimensional stability and...

Claims

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Application Information

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IPC IPC(8): C08L83/08C08L71/12C08G77/30C08G77/00C08K5/00
CPCC08K3/36C08G77/70C08J5/24C08L2203/20C08K2003/2237C08G77/30C08L2201/02C08K2003/2227C08K5/0025C08L71/126C08K5/0066C08K2003/2224C08L83/08C08L2312/02C08J5/244C08J5/249C08L63/00C08L21/00C08L9/02C08L9/06C08L55/02C08K5/01C08K5/34924C08K3/22H05K1/0366
Inventor PIOTROWSKI, ANDREWZHANG, MENG
Owner ICL IP AMERICA INC
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