Inspecting apparatus for semiconductor device

Abstract

An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 2003-40770, filed Jun. 23, 2003, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to an inspecting apparatus for a semiconductor device, and more specifically, to an inspecting apparatus that minimizes the number of semiconductor devices damaged due to faulty temperature measurements during heat durability testing.[0004]2. Description of the Related Art[0005]Generally, a handler device includes a handler to identify defective semiconductor devices, and a testing chamber to test the durability of semiconductor devices at elevated temperatures. The testing chamber plays an important role in improving the effectiveness of temperature testing of semiconductor devices.[0006]A core technology of the testing chamber is a heating / co...

AI Technical Summary

Benefits of technology

This solution significantly reduces the temperature increase in the testing chamber, enhancing testing reliability, minimizing device damage, and lowering rejection rates, thus reducing costs associated with faulty test results and device damage.

Problems solved by technology

When the heat sink is in direct contact with the semiconductor device, the contacting surfaces of the heat sink and the semiconductor device are difficult to align in parallel due to irregularities of the match plates and / or the roughness of the contacting surface of the semiconductor device.

As a result, this structural problem prevents an efficient transfer of the heat from the semiconductor device to the heat sink.

Consequently, some of the heat is transferred to the air layer between the contacting surfaces of the heat sink and the semiconductor device, causing an increase in the temperature of the testing chamber.

The increase in the temperature of the testing chamber causes the inspecting apparatus to misidentify a qualified semiconductor device as a defective semiconductor device.

Therefore, the reliability of the durability testing is lowered.

Additionally, physical contact between heat sinks and semiconductor devices frequently damage the semiconductor devices.

While inspecting apparatuses designed to transfer the heat from semiconductor devices to the heat sinks using additional heat transfer means exist, such devices not only require complex transfer structures, such as radiation members, but also are inefficient at transferring heat due to the minimal area of contact between the radiation members and the semiconductor devices.

The physical connections between the radiation members and the heat sinks have alignment problems similar to those described above.

Also, the heat transferring efficiency and the misidentification rate of semiconductor devices remain at unacceptable levels.

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