Probe card having groups of probe needles in a probing test apparatus for testing semiconductor integrated circuits
a technology for integrated circuits and probe needles, which is applied in the direction of individual semiconductor device testing, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problems of increasing the manufacturing cost of semiconductor integrated circuits and more chips will be determined to be defective, so as to improve the productivity of semiconductor integrated circuits and reduce the manufacturing cos
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first embodiment
[0043]FIG. 3 is a perspective view showing a probe card 15 according to the invention, along with a semiconductor wafer 1. FIG. 4 is a magnified plan view of a part of the card 15. As FIG. 3 illustrates, 84 IC chips 3 are provided on the wafer 1, arranged in rows and columns.
[0044]The probe card 15 is designed to probe-test the chips 3. It comprises eight groups 19a to 19h of probe needles, a substrate 20 and probe contacts 21. The probe needles of the groups 19a to 19h can contact eight chips 3a to 3h arranged in four rows and two columns. The card substrate 20 has a rectangular through hole 17 having two short sides and two long sides. The first to fourth groups 19a to 19d of needles are provided on the card substrate 20 along one long side of the hole 17, and the fifth to eighth groups 19e to 19h of needles are provided on the card substrate 20 along the other long side of the hole 17. In other words, the groups 19a to 19h of needles are arranged in two rows, each row consisting ...
second embodiment
[0055]Arranged as shown in FIG. 6, the wires of the groups 37a to 37h are shorter than otherwise, and the difference in length between the longest and shortest wires provided is relatively small. Hence, the differences in resistance and capacitance among the wires is proportionally small. In addition, since the wires are short, the crosstalk among the wires is small. The probe card 15 can therefore help accomplish high-accuracy probing test, in which eight chips are tested at the same time.
[0056]Another probe card 15 according to the third embodiment of this invention will be described, with reference to FIG. 7 which is an exploded view. The third embodiment is similar to the first embodiment. It is characterized in that the substrate 20 is designed so as to reduce the crosstalk among the wires.
[0057]As illustrated in FIG. 7, the substrate 20 is composed of seven layers 20-1 to 20-7. Probe contacts 21 are mounted on the first layer 20-1. This probe card 15 is designed for use in te...
third embodiment
[0058]Since the wires 37 of each type are provided on one layer, not together with the wires of any other type, the crosstalk among the wires 37 is far less than in the case all wires are arranged densely on one and the same layer. The probe card 15 can, therefore, help to achieve high-accuracy probing test. It has eight groups of probe needles and can serve to test eight chips at the same time.
[0059]The third embodiment can be used in combination with the probe card according to the second embodiment.
[0060]Methods of probe-testing semiconductor integrated circuits by using the probe card according to the invention will be described as the fourth, fifth and sixth embodiments.
[0061]FIG. 8 is a diagram explaining the probe-testing method according to the fourth embodiment. This method can test more chips at the same time than is possible by using the probe card 15 according to the first embodiment.
[0062]As shown in FIG. 8, four test stations43-1 to 43-4 are provided for one tester 41...
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