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Lead free solder

A lead-free solder and solder technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of low strength and plasticity, poor wettability, and high cost

Inactive Publication Date: 2007-11-28
ZHEJIANG METALLURGICAL RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention will solve the problem that the lead-free solder in the known technology has poor wettability, low strength and plasticity, or high cost. Therefore, the lead-free solder of the present invention is provided, and the cost of this solder is low. Good wettability, high strength and plasticity

Method used

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  • Lead free solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Put 30.0Kg of Sn and 20.0Kg of Bi into an alumina crucible, and put it into an intermediate frequency furnace for melting at a melting temperature of 400°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make tin containing 40% bismuth Bismuth master alloy. Put 45.0Kg of Sn and 5.0Kg of Sb into an alumina crucible, and put it into an intermediate frequency furnace for melting at a melting temperature of 400°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make tin with 10% antimony Antimony master alloy. Put 48.0Kg of Sn and 2.0Kg of Ce into an alumina crucible, and put it into a vacuum medium-frequency induction melting furnace for melting. The melting temperature is 1000°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make a cerium-containing product. 4% tin-cerium master alloy.

[0034] Take 0.019Kg of the above-mentioned tin-bismuth master alloy, 0.035...

Embodiment 2

[0036] Get 0.019Kg of tin-bismuth master alloy of embodiment 1, 0.035Kg of tin-antimony master alloy, 0.063Kg of tin-cerium master alloy and 4.884Kg of pure tin, put into the melting in stainless steel pot, melting temperature is 550 ℃, and holding time is 1.5 hours, fully After being stirred, it is released from the furnace and cast on a steel welding rod mold to obtain lead-free solder rods.

Embodiment 3

[0038] Get embodiment 1 tin-bismuth master alloy 0.194Kg, tin-antimony master alloy 0.260Kg, tin-cerium master alloy 0.088Kg and pure tin 4.459Kg, put into the melting in the stainless steel pot, melting temperature is 550 ℃, and holding time is 1.5 hours, fully After being stirred, it is released from the furnace and cast on a steel welding rod mold to obtain lead-free solder rods.

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Abstract

The invention discloses a lead free solder wherein the first kind of the welding alloy comprises the following constituents (by mass percent): Bi 0.1-3.0%, Sb 0.05-1.0%, Ce 0.001-0.1%, and balancing Sn. the second kind of the welding alloy comprises the following constituents (by mass percent): Bi 0.1-3.0%, Sb 0.05-1.0%, Ce 0.001-0.1%, Ag 0.1-0.5%, and balancing Sn. The third kind of the welding alloy comprises the following constituents (by mass percent): Bi 0.1-3.0%, Sb 0.05-1.0%, Ce 0.001-0.1%, Ag 0.1-0.5%, Cu 0.1-0.8%, and balancing Sn. The invention can be applied to leadless assemblage and packaging in the electronic technology.

Description

technical field [0001] The invention relates to a solder alloy, especially a lead-free solder alloy, which is mainly used for lead-free assembly and packaging in the electronic industry. Background technique [0002] People are more and more concerned about the pollution of lead to the environment and the damage to health. In recent years, countries around the world have successively issued a series of laws and regulations to prevent and control the ecological problems caused by electronic products, and restrict the use of lead in electronic products. Under the general trend of lead-free green manufacturing, many countries have begun to increase investment in research and development of lead-free solder, and actively promote its application. [0003] The lead-free solders that have been developed so far mainly include Sn-Ag, Sn-Cu, Sn-Zn and Sn-Ag-Cu, etc., and a series of different properties can be obtained by adding elements such as Ag, Cu, P, Ni, In,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 王大勇顾小龙杨倡进
Owner ZHEJIANG METALLURGICAL RES INST
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