Method for processing patch diode

Abstract

This invention relates to a processing method for chip diodes, which carries out oil-removing, cleaning and drying chip tube cores and upper and lower leading pin strips, puts the lower leading pin strip into a graphite mould and squeezes the paste solder onto the connection place of the pins, puts the chip tube cores on the solder of the lower leading pin strip, then, puts the upper leading pin strip on the core to close the cover, then puts the graphite into an electric oven to be heated to 350-600deg.C in 20-35min to melt the solder to be lowered to 300+-10deg.C to keep it for 10-15min then to be cooled slowly to the room temperature for 20-25min to take out the mould, puts the pin strips with chip tube cores in the mould to be injected with insulation resin to be sealed and divides the corner cut into chip diodes, bends, then plates and tests the leading pins to be packed.

Description

technical field

[0001] The invention relates to a processing method of a diode, in particular to a processing method of a patch diode. Background technique

[0002] Since the core area of ​​the chip diode is larger than that of the pillar diode, it has the characteristics of large conduction area and good voltage resistance, and it is more and more used in various printed circuit boards. However, the processing of conventional SMD diodes is to solder and fix the tin solder on the upper and lower connection surfaces of the chip die respectively, put the lower lead strip into the graphite mold, and then put the chip die and the upper lead in turn. After the upper cover of the belt and graphite mold is covered, it is sent into the electric furnace and heated to 360 ° C ~ 400 ° C, the heating time is 30 minutes ~ 45 minutes, the solid solder is heated and melted, and the upper and lower lead belts are welded to the sheet core, and finally the belt with The pin strips of the chi...