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Welding method, component connection welded by such welding method and connection structure

A technology for welding materials and electronic components, applied in the direction of welding media, electrical components, welding equipment, etc., can solve the problems of insufficient thermal fatigue resistance and poor connection, and achieve high adhesion and high thermal fatigue resistance Effect

Inactive Publication Date: 2008-04-23
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the intermetallic compound 12 containing Cu and Zn is still formed at the interface between the pad 7 containing Cu and the connection portion 8, when the obtained electronic circuit board is subjected to a continuous use test at a high temperature, the connection portion occurs. become worse
Therefore, this alloy material also has the problem of not having sufficient thermal fatigue resistance

Method used

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  • Welding method, component connection welded by such welding method and connection structure
  • Welding method, component connection welded by such welding method and connection structure

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Effect test

Embodiment Construction

[0041] The following pass figure 1 One embodiment will be described. figure 1 is a partial schematic sectional view of an electronic circuit board prepared by the soldering method of this embodiment.

[0042] First, a printed board 1 and electronic components 5 to be connected thereto are prepared. The pad 2 prepared by covering the matrix material 2a containing Cu with the barrier metal layer 2b containing Ni layer and Au layer is formed on the printed board 1, for example, the pad 2 can be formed according to the following method.

[0043] For example, the Cu-containing matrix material 2a is formed with a wiring pattern (not shown in the figure) on the surface of the printed board 1 made of epoxy glass resin or the like by thermocompression bonding (or mounting) of copper foil and etching. as a whole. For example, the width of the wiring pattern may be approximately 50-100 microns. Thereafter, a protective layer is formed in a prescribed area on the surface of the prin...

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Abstract

It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

Description

[0001] This application is based on Japanese Patent Application No. 2003-028032, which is incorporated herein by reference. technical field [0002] The present invention relates to a method of soldering one component to another, and more particularly to a method for soldering pads and electronic components (such as leads) formed on a printing plate during the manufacture of electronic circuit boards. electrode method. The invention also relates to the connection structure obtained by this soldering method and to the electrical or electronic components used in this soldering method. Background technique [0003] In the process of manufacturing electronic circuit boards for electronic equipment, until now, the method of reflow soldering has been considered to be used to mount electronic components One of the methods of electrically and physically connecting to pads formed on a printing plate. [0004] In a general method of reflow soldering, first, a so-called solder paste ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34B23K35/26C22C13/00B23K20/16B23K35/00H01L23/488H01L23/498H01L23/50H05K3/24
CPCH01L2924/0002H01L23/488B23K35/262H05K3/244B23K20/16H01L23/49811B23K2201/40H05K3/3426B23K35/007H05K3/3463B23K2101/40Y10T428/12708Y10T428/12882Y10T428/12792H01L2924/00
Inventor 山口敦史西田一人平野正人
Owner PANASONIC CORP