Method for reducing interface residual stress of steel, copper, graphite composite plate

A technology of residual stress and composite board, applied in the direction of improving process efficiency, etc., can solve the problems of high energy consumption, graphite oxidation loss, etc.

Inactive Publication Date: 2008-06-04
BEIJING JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the deficiency of "large energy consumption and graphite oxidation loss" in the method of reducing the residual stress of the interface of steel-copper-graphite semi-solid composite plate by diffusion annealing, and provide a method that can compensate for the semi-solid state between the copper-graphite coating and the steel plate. The difference in shrinkage produced during the solidification and cooling process after compounding reduces the residual stress of the composite interface and further improves the interface shear strength of the steel-copper-graphite semi-solid composite plate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0010] For the composite plate composed of 1.2mm thick 08Al steel plate and 2.8mm thick titanium bronze 3.5-3.5 graphite coating, at room temperature, on a precision rolling mill, rolling treatment with a reduction rate of 0.6%, the interface shear of the composite plate Strength increased from 127MPa to 133MPa.

Embodiment approach 2

[0012] For the composite plate composed of 1.2mm thick 08Al steel plate and 2.8mm thick titanium bronze 3.5-4 graphite coating, at room temperature, on a precision rolling mill, rolling treatment with a reduction rate of 1.0%, the interface shear of the composite plate Strength increased from 127MPa to 136MPa.

Embodiment approach 3

[0014] For the composite plate composed of 1.2mm thick 08Al steel plate and 2.8mm thick titanium bronze 4.3-5 graphite coating, at room temperature, on a precision rolling mill, rolling treatment with a reduction rate of 1.4%, the interface shear of the composite plate Strength increased from 127MPa to 132MPa.

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Abstract

This invention discloses a method for reducing the interfacial residual stress of steel / copper / graphite semi-solid composite board. The method performs rolling treatment with a rolling reduction rate of 0.6-1.4% on the steel / copper / graphite semi-solid composite board at room temperature, and utilizes the deformation difference between copper / graphite coating layer and the steel board to compensate the construction difference between them during the cooling process, thus can reducing the interfacial residual stress of the composite board and raising the shear strength of the composite board. The method can solve the problems of large energy consumption and graphite oxidation loss faced by diffusion annealing technique for reducing the interfacial residual stress of steel / copper / graphite semi-solid composite board.

Description

technical field [0001] The invention relates to a method for reducing the interface residual stress of a steel-copper-graphite semi-solid composite plate. Background technique [0002] Steel-copper-graphite composite plate is a composite plate composed of steel plate and copper-graphite self-lubricating coating. It is an ideal material for preparing modern new bearing bushes. The self-lubricating coating has high strength and good interface mechanical properties, especially the service temperature can be as high as 300 ℃, which is unmatched by steel-aluminum matrix composite panels. This composite panel is very suitable for the development trend of "high speed and heavy load". The steel-copper-graphite semi-solid composite plate is compositely formed by solid steel plate and copper-graphite semi-solid slurry. Since the expansion coefficient of the copper-graphite coating is greater than that of the steel plate, during the solidification and cooling process after the steel-co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C21D7/02
CPCY02P10/20
Inventor 张鹏杜云慧刘汉武
Owner BEIJING JIAOTONG UNIV
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