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Silicon chip transmitting system with visual sensor and transmitting method thereof

A vision sensor and transmission system technology, applied in the direction of conveyor objects, transportation and packaging, semiconductor/solid-state device manufacturing, etc., can solve the problems of large volume, waste of resources, complicated steps, etc., to reduce the overall volume, reduce The effect of small footprint and simple steps

Active Publication Date: 2008-06-11
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0007] The disadvantage of the above-mentioned prior art is that since the silicon wafer position measuring device 3 is to be installed in the vacuum transfer chamber 1, a certain space is occupied, so that the volume of the vacuum transfer chamber 1 is relatively large, resulting in a large overall volume of the semiconductor etching equipment. , occupies a large area and wastes resources; in addition, the vacuum manipulator needs to place the silicon wafer on the silicon wafer position measurement device for position calibration, and then take out the silicon wafer from the silicon wafer position measurement device and transfer it to the reaction chamber. The steps are cumbersome , long time, low efficiency

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  • Silicon chip transmitting system with visual sensor and transmitting method thereof
  • Silicon chip transmitting system with visual sensor and transmitting method thereof

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Embodiment Construction

[0026] The specific implementation of the silicon wafer transport system with vision sensor of the present invention will be further described in detail below in conjunction with the accompanying drawings, but it is not used to limit the protection scope of the present invention.

[0027] see figure 2 . The silicon wafer transfer system with vision sensor of the present invention includes a vacuum manipulator 2 installed in the vacuum transfer chamber 1 and two vision sensors installed outside the vacuum transfer chamber 1 . The probe 4 of the visual sensor is located at the position where the retraction action is completed after the vacuum manipulator 2 picks up the film. The probe 4 is not limited to this position, and it can be on any position that must pass through after the vacuum manipulator 2 picks up the silicon wafer, even , the probe 4 is not in the various positions mentioned above, such as on the transparent cover of the vacuum transfer chamber 1, etc., as long a...

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Abstract

The present invention relates to a silicon wafer transmission system with visual sensor in semiconductor etching equipment and its transmission method. Said system includes vacuum robot mounted in vacuum transmission chamber interior and visual sensor mounted outside of vacuum transmission chamber. The visual sensor is used for detecting silicon wafer centre position and vacuum robot centre position condition after the silicon wafer is taken out by vacuum robot. Because the visual sensor is mounted outside of vacuum transmission chamber, so that the volume of said vacuum transmission chamber can be greatly reduced. Said invention also provides the concrete steps of said transmission method by means of computer.

Description

technical field [0001] The present invention relates to a semiconductor etching device, in particular to a silicon wafer transfer device in the semiconductor etching device; the invention also relates to a transfer method using the transfer device. Background technique [0002] The role of some semiconductor equipment is to perform certain treatments on silicon wafers by physical and chemical means. This treatment is called semiconductor technology, and silicon wafers are usually processed in airtight containers in a vacuum environment. These containers are often referred to as reaction chambers. [0003] As a part directly connected to the reaction chamber, the vacuum transfer chamber, together with the vacuum manipulator inside it, needs to complete the work of accurately transferring the silicon wafer to be reacted to the reaction chamber in semiconductor production. The vacuum manipulator is driven by a stepping motor or a servo motor. After the silicon wafer is accurat...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/67H01L21/3065H01L21/00
Inventor 夏威
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD