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Self adaptive lead-free solder component preparation method

A lead-free solder, self-adaptive technology, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of poor wettability, difficulty in uniform compounding of nickel-titanium shape memory alloy particles, and little effect, and achieve The tight effect

Inactive Publication Date: 2008-08-20
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor wettability between the nickel-titanium shape memory alloy particles and the solder and the substrate, it is very difficult to successfully compound the nickel-titanium shape memory alloy particles in the matrix evenly. Flux is used to improve its wettability, but on the one hand, it has little effect, and on the other hand, the increase in cost is also a problem

Method used

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  • Self adaptive lead-free solder component preparation method
  • Self adaptive lead-free solder component preparation method
  • Self adaptive lead-free solder component preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The tin, silver, and zinc with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon in a mass ratio of 99.99% by mass ratio of 99.99%, and magnetically stirred at the same time to make the alloy composition uniform, and then the water is condensed and solidified. . Then, the alloy was turned over and reheated to 1200°C to melt, and at the same time, it was magnetically stirred and water-cooled. Repeat this at least five times to obtain button-shaped tin-silver-zinc lead-free solder with a diameter of about 3.0-3.5cm; put the tin-silver-zinc lead-free solder into a crucible under vacuum protection and heat it to 230°C, and quickly pass it through Water quenching produces silver-zinc thermoelastic martensite in the solder, making it have a two-way shape memory effect between 20°C and 100°C, resulting in a tin-silver-zinc adaptive lead-free solder with shape memory properties. The microstructure of the self-adaptive lead-free solder...

Embodiment 2

[0017] Heat tin, silver, zinc, and indium with a purity of 99.99% at a mass ratio of 94.9:3.7:0.9:0.5 in a vacuum melting furnace under the protection of argon to 1300°C, and magnetically stir at the same time to make the alloy composition uniform. , And then the water condenses and solidifies. Then the alloy is turned over and reheated to 1300°C to melt, while being magnetically stirred and water-cooled. Repeat this at least five times to obtain button-shaped tin-silver-zinc lead-free solder with a diameter of about 3.0-3.5cm; put the tin-silver-zinc lead-free solder into a crucible under vacuum protection and heat it to 250°C, and quickly pass it through Water quenching generates silver-zinc thermoelastic martensite in the solder, making it have a two-way shape memory effect between 30°C and 110°C, resulting in a tin-silver-zinc adaptive lead-free solder with shape memory properties. The microstructure of the self-adaptive lead-free solder obtained after preparation is like imag...

Embodiment 3

[0019] The tin, silver, and zinc with a purity of 99.99% are heated to 1350°C in a vacuum melting furnace under the protection of argon in a mass ratio of 96.1:3.4:0.5, and magnetically stirred at the same time to make the alloy composition uniform, and then the water is condensed and solidified. . Then, the alloy was turned over and reheated to 1350°C to melt, and at the same time, it was magnetically stirred and water-cooled. Repeat this at least five times to obtain button-shaped tin-silver-zinc lead-free solder with a diameter of about 3.0-3.5cm; put the tin-silver-zinc lead-free solder into a crucible under vacuum protection and heat it to 255°C, and quickly pass it through Water quenching produces silver-zinc thermoelastic martensite in the solder, making it have a two-way shape memory effect between 35°C and 115°C, resulting in a tin-silver-zinc adaptive lead-free solder with shape memory properties. The microstructure of the self-adaptive lead-free solder obtained after pr...

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Abstract

The invention relates to a tin-silver-zinc self-adapt leadless solder with shape memory function and relative preparation, wherein in the tin-silver-zinc leadless solder whose purity is 99.99% and mass percentages are 96.5-93: 3.0-4.5: 0.5-2.5, there is silver-zinc metal phase with shape memory function; then it adds 0-2.5 gallium and 0-4 indium to improve humidity. The invention uses the silver-zinc thermoelasticity martensite of solder to obtain shape memory function. And it has compact combination and uniform distribution, compared with nickel-titanium alloy leadless solder.

Description

Technical field [0001] The invention relates to a tin-silver-zinc self-adaptive lead-free solder composition and a preparation method with shape memory performance, and belongs to lead-free solder technology. Background technique [0002] Paying attention to environmental protection and advocating green products are the major trends in the economic development of the world today. Traditional lead-tin solder has been used for about two thousand years, and it is widely used in modern electronic assembly industry. However, due to the harm of lead to human nervous system that can not be ignored to human health, the problem of lead pollution has been paid more and more attention by people, so that there is a high demand for the realization of lead-free electronic products in the world. The Waste Electrical and Electronic Equipment (WEEE) organization under the leadership of the European Union requires that the use of lead-containing materials in the electronics assembly industry be st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C1/02C22F1/00
Inventor 韦晨刘永长
Owner TIANJIN UNIV
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