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Method for fabricating tantalum capacitor and products

A tantalum capacitor and voltage technology, applied in the field of tantalum capacitor preparation, can solve the problems of high cost, high energy consumption, unstable product properties, etc., and achieve the effects of low cost, improved reliability and life, and reduced leakage current

Inactive Publication Date: 2008-12-03
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method adopts high temperature heating, energy consumption is big, cost is high, and product property is not stable

Method used

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  • Method for fabricating tantalum capacitor and products
  • Method for fabricating tantalum capacitor and products
  • Method for fabricating tantalum capacitor and products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] according to image 3 The steps shown to prepare a tantalum capacitor where:

[0028] The conditions of the heat treatment step are: temperature 250°C, heating time 15 minutes. The treatment method is to put the product that has undergone the first chemical transformation in a high-temperature drying oven that has reached the set temperature, and quickly close the door of the drying oven to avoid temperature drop. Too much, then timing, after the time is up, take out the product and cool it to room temperature naturally;

[0029] The conditions for the second formation are: voltage 50V, temperature 20°C, and time 20 minutes; the treatment method is to immerse the heat-treated product in the formation solution and set the voltage.

[0030] The conditions and treatment methods of other processes are the same as those of the prior art.

[0031] After the leakage current test, the leakage current of the product prepared by the above method is obviously lower than that of ...

Embodiment 2

[0032] Embodiment 2 chemical formation process

[0033] Tantalum capacitors were prepared according to the method described in Example 1, except that the heat treatment conditions were: temperature 350°C, time 20 minutes, and the conditions of the second chemical conversion treatment were: voltage 60V, temperature 60°C, time 45 minutes.

[0034] After the leakage current test, the leakage current of the product prepared by the above method is obviously lower than that of the product prepared by the conventional process.

Embodiment 3

[0035] Embodiment 3 chemical conversion process

[0036] Tantalum capacitors were prepared according to the method described in Example 1, except that the heat treatment conditions were: temperature 450°C, time 30 minutes, and the conditions of the second chemical conversion treatment were: voltage 70V, temperature 90°C, time 70 minutes.

[0037] After the leakage current test, the leakage current of the product prepared by the above method is obviously lower than that of the product prepared by the conventional process.

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Abstract

The disclosed method includes first formation, heat treatment and second formation. Temp of heat treatment is carried out at 250-450 deg.C and for 15-30 min. In second formation, voltage is 50-70V; time is 20-70 min and temperature is 20-90 deg.C. Leakage current of the product is reduced greatly, and reliability and service life is raised greatly.

Description

technical field [0001] The present invention relates to a preparation method of a tantalum capacitor and its products, more specifically, the present invention relates to a preparation method of a tantalum capacitor using heat treatment and secondary chemical formation processes and its products. Background technique [0002] With the continuous innovation of technology in the microelectronics industry, the volume required for electronic complete machines is getting smaller and smaller. Tantalum capacitors have the characteristics of small size and high reliability, and can be widely used in aerospace, sea (earth) cables, cutting-edge military equipment, film and television equipment, communication equipment, and household appliances. However, in order to meet the needs of the market, the future development trend of tantalum capacitors is smaller size and higher reliability. figure 1 is a cross-sectional view of a tantalum capacitor. [0003] With the miniaturization of ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/052H01G13/00H01G9/00
Inventor 王英红刘伟荣蒋建新马文娟
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG