Semiconductor device

Abstract

A semiconductor device, wherein a substrate (51) is formed in a rectangular shape with four sides along dicing lines, and a jetty part (56) is formed to surround all the peripheries of an actuator element (50) and electrode pads (54) and (55) for input / output. The jetty part (56) is formed in a rectangular shape with four sides, and each side thereof is continuously extended parallel with each side of the substrate (51). Since the adhesion of a protective tape (9) can be increased by the jetty part (56), foreign matters (104) produced in dicing can be prevented from adhering to the actuator element (50) and the electrode pads (54) and (55).

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly to a semiconductor device divided into individual chips by dicing. Background technique [0002] Figure 13 is a schematic diagram of the actuator, (a) shows a plan view, and (b) is a cross-sectional view along line B-B in (a). [0003] exist Figure 13 Among them, the actuator 50 is a laminated structure including a substrate 51 , a fixing portion 52 , a conductive layer 53 and electrode pads 54 , 55 . The conductive layer 53 is formed in a disk shape, and is supported by the fixing portion 52 in a cantilever beam manner, so as to form a gap region 57 with the substrate 51 . The conductive layer 53 moves up and down with the fixing portion 52 as a fulcrum in response to an input electric signal supplied to the electrode pad. [0004] like Figure 14 As shown, when forming a plurality of Figure 13 After executing the components 50 shown, each component is cut and segment...

AI Technical Summary

Problems solved by technology

Therefore, although the fixed electrode and the movable electrode can be protected by providing a cover, since the electrode pad is exposed, it is easy to cut the electrode pad when cutting the substrate, resulting in an open circuit

[0010] In addition, when dust and swarf adhere to the electrode pad, the resistance value will increase, which may cause welding obstacles and reduce reliability.

Moreover, when the electrode gasket meets water, the metal will deteriorate, which will lead to problems such as a decrease in the bonding force of the weld.

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