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Packaging method for electronic nose system

A packaging method and electronic nose technology, applied in the direction of circuits, electrical components, electrical components, etc., can solve the problems that do not meet the necessary conditions for direct contact of micro-gas sensors, and achieve the effects of reducing device failure, meeting working conditions, and being easy to implement

Inactive Publication Date: 2009-04-01
DALIAN UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, SiP technology mostly adopts multi-chip overlapping and flip-chip packaging processes. The chips and packages are tightly combined and sealed, which does not meet the necessary conditions for direct contact between the micro-gas sensor and the detected environment.

Method used

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  • Packaging method for electronic nose system
  • Packaging method for electronic nose system

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Embodiment Construction

[0010] 1. The package body is made by the existing process of making TO5 or TO8 and other similar structures. During the production, the lead posts are made according to the pins of the gas sensor, and the external pins are made according to the needs of the input and output ports of the electronic nose interface circuit, and the pins are connected. The upper leads protrude to serve as connecting leads with the integrated circuit module or corresponding PCB board. Existing technology can be realized.

[0011] 2. If using figure 1 As shown in the structure, the internal interface PCB board is made, and the connection lead holes are opened around the board according to the size of each pin of the package, and the pads are made. The integrated circuit is packaged on the PCB board using the existing packaging process: if the packaging process of pressure welding and then plastic packaging is used, the pad is made; if the flip chip packaging process is used, the PCB board is proce...

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Abstract

This invention discloses an electronic nose packaging technology of a system-in-a-packaging structure which puts an IC module under a microsensor and applies leading posts in the packaging unit as the connection internal leads between the sensor and ASIC, either integrates the gas sensor signal proeorsand control module and the microgas sensor in a same packaging unit or reduces the hidden trouble of loss caused by damage to the inner leads.

Description

technical field [0001] The invention belongs to the technical field of electronic testing. It relates to an electronic nose packaging technology with a System-in-a-Package structure. Background technique [0002] The electronic nose is an instrument that uses multiple gas sensors or gas sensing units to form an array, and uses information fusion technology to identify and quantify the measured gas. Because it can improve the selectivity of gas sensors and reduce false alarms caused by cross-sensitivity of gas sensors, it has attracted the interest of many researchers and manufacturers. The use of independent gas sensors to form an array often faces the problem of large volume and high power consumption of the detection probe due to the large number and large volume of gas sensors, which is not conducive to portability. At present, the development of micro-gas sensors and micro-sensor arrays has achieved preliminary results. The monolithic electronic nose technology, which...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/00H01L21/50
CPCH01L2224/48091H01L2224/49171
Inventor 魏广芬唐祯安余隽张洪泉范茂军
Owner DALIAN UNIV OF TECH