Method of electronic assembly heat conduction

An electronic component and heat conduction technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of heat conduction barriers, heat conduction formation barriers, and the inability to achieve zero-gap sealing state of metal materials, achieving high heat conduction efficiency, Effect of high voltage and temperature

Inactive Publication Date: 2009-04-08
戴 瑞丰 +1
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  • Application Information

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Problems solved by technology

[0004] 1. The known insulating film technology, which is produced by spraying or printing, cannot achieve a zero-gap tightness with the metal material, and the existing gap will form an obstacle in the heat conduction
[0005] 2. The capillary phenomenon formed in the production process of the known insulating film technology must be made with a certain thickness to achieve the insulation effect, which leads to obstacles in heat conduction
[0006] 3. The thermal conductivity of non-metallic materials is not good, so that the heat generated by the components cannot be quickly transferred to the heat-dissipating metal materials

Method used

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  • Method of electronic assembly heat conduction
  • Method of electronic assembly heat conduction
  • Method of electronic assembly heat conduction

Examples

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Embodiment Construction

[0023] Please refer to Figure 1 and Figure 2, which is an example of the present invention when it is applied to an LED lighting device. An oxidized insulating dielectric layer B is formed on the surface of the highly conductive metal material A, and the oxidized insulating dielectric layer B has the characteristics of high temperature resistance and high voltage resistance at the same time, and then a layer is formed at a specific position on the oxidized insulating dielectric layer B as Conductive metal film C for energization, and connectable wire 111 is energized to one or more than one electronic components A1 located on the high-conductivity metal material A, when the electronic components A1 conducts electricity and generates heat energy, it can be quickly transmitted to the high-conductivity On the conductive metal material A, the heat energy generated by the electronic component A1 can be quickly taken away to achieve an excellent heat exchange effect. The aforemention...

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Abstract

The invention relates to an electronic component heat conducting method, firstly an high temperature-resistant and high voltage-resistant insulating medium layer on a cleaned high conductivity metal material surface by electrolytic oxidation treatment, then making a conductive metal film layer in the specific position on the insulating medium layer, or according to the required multiple conductive metal wire film, making the high conductivity metal material, insulating layer and conductive metal film closely bonded together, and arranging the electronic component on the high conductivity metal material, when the electronic component produces heat after electrified, the heat can be quickly conducted to the high conductivity metal material so as to achieve the extremely good heat exchange effect.

Description

technical field [0001] The present invention relates to a method for heat conduction of electronic components, in particular to a method of electrolytic oxidation treatment on the surface of a cleaned high-conduction metal material to form an insulating medium layer with high temperature resistance and high voltage resistance characteristics, and then on the surface Make a layer of conductive metal film or as many conductive metal wire films as required on the specific position of the insulating medium layer, so that the highly conductive metal material, insulating layer, and conductive metal film are closely combined, and the The electronic component is arranged on the high-conductivity metal material, and when the electronic component conducts electricity and generates heat energy, it can quickly transfer to the high-conduction metal material to achieve an excellent heat exchange effect of the electronic component heat conduction method. Background technique [0002] It is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H05K7/20
CPCH01L2224/48091H01L2924/19107
Inventor 戴瑞丰戴芸
Owner 戴 瑞丰
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