Method for adopting positive electronic corrosion-resistant to prepare metal nano electrode
A metal nano-resist technology, applied in circuits, electrical components, opto-mechanical equipment, etc., can solve problems such as inability to mass-produce, single electrode material, and difficulty in achieving nanoscale resolution in optical lithography
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[0021] In order to further illustrate the content of the present invention, the specific method of the present invention is further described in detail by describing specific implementation examples below in conjunction with the accompanying drawings, wherein:
[0022] Such as figure 1 As shown, on the flat and clean SiO 2 、Si 3 N 4 、Al 2 o 3 , MgO, CaO and other insulating substrates, high-resistance state Si, Ge, GaAs, GaN, InP, InAs, ZnO, ZnS, CdS and other semiconductor substrates 1 Coat single or multi-layer high-resolution positive Resist 2, such as PMMA, ZEP520, KRS, UV-III, P(SI-CMS), etc. Then, pre-baking the above-mentioned coated electronic resist 2 with an oven or a hot plate for a certain time and a certain temperature.
[0023] Such as figure 2 As shown, regions 3 and 4 of the positive resist 2 were subjected to e-beam direct write exposure, and regions 5 and 6 were not exposed. The interval between region 3 and region 4, that is, the width of unexposed ...
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