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Method for adopting positive electronic corrosion-resistant to prepare metal nano electrode

A metal nano-resist technology, applied in circuits, electrical components, opto-mechanical equipment, etc., can solve problems such as inability to mass-produce, single electrode material, and difficulty in achieving nanoscale resolution in optical lithography

Active Publication Date: 2009-06-03
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The Chinese invention patent with application number 200410010181.2 uses an atomic force microscope (AFM) to etch nanowires combined with chemical methods to prepare silver nanoelectrodes, which has the disadvantages of low efficiency and incapable of large-scale production
The Chinese invention patent with application number 99116576.4 uses flame melting and etching methods to prepare carbon fiber nano-electrodes, the electrode material is single, and it is only used in the biological field
Due to its high efficiency, optical lithography is currently the mainstream technology for making electrodes, but the resolution of optical lithography is limited by the exposure wavelength and it is difficult to achieve nanoscale resolution.

Method used

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  • Method for adopting positive electronic corrosion-resistant to prepare metal nano electrode
  • Method for adopting positive electronic corrosion-resistant to prepare metal nano electrode
  • Method for adopting positive electronic corrosion-resistant to prepare metal nano electrode

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Embodiment Construction

[0021] In order to further illustrate the content of the present invention, the specific method of the present invention is further described in detail by describing specific implementation examples below in conjunction with the accompanying drawings, wherein:

[0022] Such as figure 1 As shown, on the flat and clean SiO 2 、Si 3 N 4 、Al 2 o 3 , MgO, CaO and other insulating substrates, high-resistance state Si, Ge, GaAs, GaN, InP, InAs, ZnO, ZnS, CdS and other semiconductor substrates 1 Coat single or multi-layer high-resolution positive Resist 2, such as PMMA, ZEP520, KRS, UV-III, P(SI-CMS), etc. Then, pre-baking the above-mentioned coated electronic resist 2 with an oven or a hot plate for a certain time and a certain temperature.

[0023] Such as figure 2 As shown, regions 3 and 4 of the positive resist 2 were subjected to e-beam direct write exposure, and regions 5 and 6 were not exposed. The interval between region 3 and region 4, that is, the width of unexposed ...

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Abstract

A method uses the positive electron anticorrosion agent to prepare metal nano electrode. The main features of the invention is to use the neighboring effect of electron band, use the EBL to gain a pair or a group of the positive electron anticorrosion agent groove figures that have line, hole and other various shapes at the space that is measured by nano on various underlay, and then use secondly the metal deposition and peel off technology to prepare various metal material nano electrode. The main procedures of which include coating the positive electron anticorrosion agent on the interlay; baking frontally; expose by direct electron band; develop; to fix; vaporize or sputtering metal; to peel off in the acetone. The distance between the metal nano electrode that is prepared by such method can be 30~100mm, is suitable to make various quanta component, nano line, nano tube component, single electronic component and various components or circuit. The method has many advantages, such as: less technology procedure, simple, stable and reliable, multiple uses and can be compatible with the traditional CMOS technology.

Description

technical field [0001] The invention belongs to the technical field of nano processing, in particular to a method for preparing a metal nano electrode. Background technique [0002] For more than half a century, semiconductor integrated circuits with CMOS as the mainstream technology have been developing rapidly following "Moore's Law". Nanoelectronic devices with new principles, such as various quantum dot devices, nanowires, nanotube devices, and single-electron devices, have become research hotspots. In the manufacture of these nanoelectronic devices, the manufacture of nanoelectrodes with small size, good conductivity and nanoscale gaps is a key and difficult point. [0003] The Chinese invention patent with application number 200410095163.9 mainly uses chemical methods combined with the use of polymer materials to prepare electrodes, but this electrode has not reached the nanometer scale. The Chinese invention patent with the application number 200410010181.2 uses an ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/28H01L21/027G03F7/00
Inventor 龙世兵刘明陈宝钦
Owner SEMICON MFG INT (SHANGHAI) CORP