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Stacked photovoltaic device

A photoelectric element, laminated technology, applied in the direction of electrical elements, photovoltaic power generation, electric solid state devices, etc., can solve the problems of undisclosed, different film quality and light degradation characteristics, etc.

Inactive Publication Date: 2009-06-03
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, since it is considered that microcrystalline silicon has less or almost no characteristic deterioration due to light irradiation compared with amorphous silicon, in a stacked photovoltaic element in which a plurality of i-type semiconductor layers are formed of microcrystalline silicon, for The question of which laminated structure is most suitable for the characteristics of photovoltaic power generation has not been disclosed so far to provide a clear answer to this question
[0009] However, in fact, even in microcrystalline silicon, the film quality and photodegradation characteristics are greatly different depending on the formation conditions and film thickness. Therefore, it is necessary to fully consider the photodegradation characteristics of microcrystalline silicon when designing multilayer photovoltaic devices.

Method used

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Examples

Experimental program
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Embodiment 1

[0163]

[0164] The multilayer photovoltaic element of this example was deposited by the deposited film forming apparatus shown in FIG. 5 . Table 3 shows common stacking conditions used in Example 1 and Comparative Example 1. Fabrication conditions are selected such that the i-type semiconductor layer of the top element is amorphous silicon, and the i-type semiconductor layers of the middle and bottom elements are microcrystalline silicon. The film thickness of the i-type semiconductor layer of the element in Example 1 is 2.0 μm, and a three-element with the middle element as the control element and the Voc / t of the middle element is larger than the Voc / t of the bottom element is produced. In Comparative Example 1, the film thickness of the element was increased to 2.5 μm, the bottom element was used as the control element, and the Voc / t value was still the largest among the three elements of the middle element.

[0165] table 3

[0166]

[0167] In Table 4, the value o...

Embodiment 2

[0172] (Example 2, Comparative Example 2)

[0173] In this embodiment, by adjusting the film thickness and film-forming conditions of the reflection-enhancing film, compared with the reflection-enhancing film used in Example 1, the texture degree of the surface of the reflection-enhancing film is greatly improved. Thereby, the number of photons absorbed by the bottom element can be increased, and the film thickness of the bottom i layer can be reduced. However, in Example 2, each semiconductor layer was formed under the conditions shown in Table 3, except that the film thickness of the i layer of the bottom element was reduced to 2.0 μm. As in Example 1, the i-type semiconductor layer of the top element is amorphous silicon, and the i-type semiconductor layers of the middle element and the bottom element are microcrystalline silicon. The thickness of the i-type semiconductor layer of the element in Example 2 is 2.5 μm, and a three-element with the top element as the control e...

Embodiment 3、 comparative example 3-1、3-2

[0180] In this embodiment 3, in addition to the formation conditions of the n-type semiconductor layer of the bottom element, the n-type dopant gas, namely pH 3 The flow rate was increased to 20 times that of Example 1, and each semiconductor layer was formed under the same conditions as in Example 1 shown in Table 3. By increasing the pH 3 It was found that the Voc increased, but by reducing the short-circuit photocurrent density of the bottom element, it became the bottom control element, and the same value was obtained as the photoelectric conversion efficiency. This is considered to be due to the influence of the diffusion of P into the i-type semiconductor layer. Actually, SiMS measurement was performed, and the P concentration in the bottom i-type semiconductor layer was higher than that in the bottom i-type semiconductor layer of Example 1 on average by half a digit. In addition, as in Example 1 and Example 2, the P concentration in the middle i layer was negligibly l...

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Abstract

Provided is a stacked photovoltaic device characterized in that: a first i-type semiconductor layer comprises amorphous silicon hydride, and second and subsequent i-type semiconductor layers comprise amorphous silicon hydride or microcrystalline silicon, the i-type semiconductor layers being stacked in order from a light incidence side; and when an open circuit voltage is assigned Voc in the case where a pin photoelectric single element is manufactured using a pin element having the i-type semiconductor layer made of microcrystalline silicon of pin elements having the second and subsequent i-type semiconductor layers, respectively, and a layer thickness of the i-type semiconductor layer concerned is assigned t, a short-circuit photoelectric current density of the stacked photovoltaic device is controlled by the pin element including the i-type semiconductor layer having the largest value of Voc / t.

Description

technical field [0001] The present invention relates to photoelectric elements such as solar cells, sensors, and imaging elements, and more particularly to a multilayer photoelectric element in which a plurality of pin junctions are laminated. Background technique [0002] So far, there have been many disclosures on the technology of stacked photovoltaic elements in which a plurality of pin elements are connected in series for the purpose of increasing the efficiency of amorphous silicon solar cells and reducing photodegradation. By stacking into one, sunlight can be divided into multiple wavelength-sensitive regions and absorbed, so that photogenerated carriers can be used more efficiently, and at the same time, photogenerated carriers generated by each element can be reduced to reduce photodegradation . [0003] For example, a-SiC / a-Si / a-SiGe, a-Si / a-SiGe / a-SiGe, a-SiC / a-SiGe / a - Elements such as SiGe (see Japanese Patent Application Laid-Open No. 5-102505), experiments ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/075H01L31/078C23C16/24C23C16/50H01L21/205H01L25/00H01L31/032H01L31/04H01L31/06H01L31/076H01L31/18H01L31/20
CPCH01L31/076Y02E10/548Y02E10/50
Inventor 杉山秀一郎盐崎笃志高井康好都筑英寿
Owner CANON KK
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