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Method for increasing joining point strength between suspending film joining pin and substrate

A technique of suspending thin films and connection points, applied in sustainable manufacturing/processing, electrical components, climate sustainability, etc., to achieve the effect of increasing strength, increasing strength, and improving electrical quality

Inactive Publication Date: 2009-06-24
UNIMEMS MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, when the pins and the substrate are to be bonded, the height of the pins must be lowered from the height of the suspending film to the surface of the conductive layer of the read circuit, but the conductive film on the pins is very thin, thus forming a relatively fragile circuit. sexual connection

Method used

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  • Method for increasing joining point strength between suspending film joining pin and substrate
  • Method for increasing joining point strength between suspending film joining pin and substrate
  • Method for increasing joining point strength between suspending film joining pin and substrate

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Embodiment Construction

[0015] The method for increasing the strength of the connection point between the suspending film pin and the substrate of the present invention effectively improves the electrical bonding strength between the infrared sensing film pin and the reading circuit in the substrate, and increases the connection point between the pin and the substrate Excellent mechanical strength, which can improve the qualified rate of infrared sensor production. The following will be described in detail in conjunction with the accompanying drawings to clearly illustrate the spirit of the present invention. After those skilled in the art understand the preferred embodiments of the present invention, they can be changed and modified by the technology taught in the present invention. depart from the spirit and scope of the present invention.

[0016] Figure 1-10 It is a schematic flow chart of the method for increasing the pin strength of the suspended film of the present invention. It takes a readi...

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Abstract

This invention relates to a method for increasing the connecting point intensity of suspended pins and a substrate, which provides a fetch circuit chip first and forms a sacrificial layer on it, then forms an electric contact window in the sacrificial layer to expose a conduction layer of the fetch circuit chip and fills a metallic layer in the contact window to form an electric couple of the conduction film and the metallic layer, then forms an infrared sensing layer and an upper dielectric layer on the conduction film.

Description

technical field [0001] The present invention relates to a method for improving the production yield of infrared sensors, and in particular to a method for increasing the strength of connection points between suspending film pins and substrates to increase the production yield of infrared sensors. Background technique [0002] With the rapid progress of the semiconductor industry and electronic technology, the manufacturing technology of infrared sensors is also improving day by day. Infrared sensors can not only be used in medicine to measure body temperature, but can also be used in science, business and military, such as laser detection, missile guidance, infrared spectrometer, remote control, anti-theft device, thermal image reconnaissance, etc. superior. The infrared sensors can be mainly divided into two categories: thermal and photon. Since thermal infrared sensors are more convenient to use, they are widely used in general. [0003] In general, thermal infrared sen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L31/18
CPCY02P70/50
Inventor 李宗升邱景宏欧政隆
Owner UNIMEMS MFG