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Liquid processing method and device thereof

A liquid processing and liquid processing technology, which is used in spraying devices, spraying devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of reduced substrate quality, watermarks or scars, etc., to reduce the amount of drying gas, prevent watermarks, suppress produce watermark effect

Inactive Publication Date: 2009-10-14
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, watermarks or scars will be generated on the part where the mist is attached, and there is a problem that the quality of the substrate will be lowered.

Method used

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  • Liquid processing method and device thereof
  • Liquid processing method and device thereof
  • Liquid processing method and device thereof

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Embodiment Construction

[0044] Hereinafter, preferred embodiments of the present invention will be described. figure 1 shows a coating and development processing system as an example of the configuration of the substrate processing method and substrate processing apparatus to which the present invention can be applied. The coating and development processing system 10 is arranged in a clean room, for example, the LCD substrate is used as the substrate to be processed, and the cleaning, resist coating, pre-baking, developing, and Various treatments such as post-baking. Exposure processing is performed by an external exposure device 12 provided adjacent to the system.

[0045] The coating and development processing system 10 is equipped with a horizontally long processing station (P / S) 16 at the center, and a box station (C / S) 14 and an interface station ( I / F) 18.

[0046] Cassette station (C / S) 14 is the cassette delivery entrance of the system 10. In order to stack the substrates G in multiple lay...

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PUM

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Abstract

A liquid processing apparatus for supplying a processing liquid onto a substrate and performing liquid processing, comprising a liquid processing unit for supplying a predetermined processing liquid onto the substrate for liquid processing while conveying the substrate in a substantially horizontal posture, A gas injection nozzle for spraying drying gas on the wafer is a drying processing section that sprays drying gas onto the substrate using the gas injection nozzle while transporting the substrate that has been processed in the liquid processing section in a substantially horizontal posture. In the processing section, in order to form a liquid film of the processing liquid on the substrate, an injection amount control device controls a flow velocity of the dry gas injected from the gas injection nozzle.

Description

[0001] This application is a divisional application, the application number of the parent application is 03119834.1, the application date is March 4, 2003, and the invention title of the parent application is a liquid processing method and a liquid processing device. technical field [0002] The invention relates to a liquid processing method and a liquid processing device in a continuous assembly line method in which substrates are continuously processed on the assembly line. Background technique [0003] Recently, in the resist coating and development processing system in LCD (liquid crystal display device) production, as a cleaning method or a developing method that can advantageously correspond to the enlargement of the LCD substrate, the conveying roller or the conveying belt is moved along the horizontal On the conveying path arranged in different directions, the so-called continuous line method is popularized in which LCD substrates are conveyed while being developed o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/30G02F1/1333B05B1/00H01L21/027
Inventor 八寻俊一立山清久元田公男
Owner TOKYO ELECTRON LTD