Sensing chip structure with overlapping pattern layer, sensing chip encapsulation and preparation method
A technology for sensing chips and manufacturing methods, which is applied in radiation control devices, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve problems such as hidden worries and difficulties in production output
Inactive Publication Date: 2010-01-06
IND TECH RES INST
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Problems solved by technology
[0006] Combining the above-mentioned manufacturing methods, the process mode of single and individual processing is a big worry in terms of production output (throughput). In addition, the relatively high-cost preformed plastic base components will undoubtedly make the cost of the overall module worse. Therefore, the As far as the existing global module processing structure is concerned, it may be quite difficult to improve the overall module construction cost. Therefore, breaking away from the existing construction format is a problem in solving this problem. A necessary subject is also a necessary means
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[0058] The preferred embodiments of the present invention are described in detail as follows in conjunction with the accompanying drawings.
[0059] see Figure 2A and Figure 2D As shown, the sensing chip structure 20 with a covering pattern layer of the present invention includes: a sensing chip 21 and a covering pattern layer 30, the sensing chip 21 has an active surface 211 and a crystal back 212, the active surface 211 has an active area 2111 and a plurality of bonding pads 2112. The covering pattern layer 30 is disposed on the active surface 211 of the sensing chip 21 and surrounds the periphery 21111 of the active area 2111. The inner area 32 is hollow.
[0060] Continued please refer to Figure 2B A cross-sectional view of an embodiment of a via hole in a sensing chip structure of the present invention. There may also be an electrical via hole 2124 under the pad 2112 in the sensing chip structure 20a penetrating through to the crystal back 212, and the crystal back ...
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The invention discloses a sensing chip structure with a covering pattern layer, a sensing chip package combined with the sensing chip structure, and a manufacturing method thereof. The sensing chip structure comprises a sensing chip, and a covering pattern layer arranged surrounding the periphery of an active region on an active surface thereof. The sensing chip structure with the covering pattern layer can be array-bonded in batches, electronically coupled with a carrier and then packaged in a centralized way. During package, the top of the covering pattern layer can be abutted against the inner surface of a package mold, so that the packaging material covering the sensing chip is stopped on the peripheral surface of the covering pattern layer and bonded therewith, thereby forming an opening space on the surface of the active region of the sensing chip. The inventive manufacturing method can omit the step of removing the sealant on the surface of the active region.
Description
technical field [0001] The present invention relates to a sensing chip structure, a sensing chip assembly and a manufacturing method thereof, in particular to a covering pattern layer structure formed on the active area of the sensing chip to be bonded with the sealant and applied to the covering pattern A structure forming a space in a layer and a manufacturing method thereof. Background technique [0002] At present, global consumer electronic products, such as watch blood pressure monitors, mobile phones, etc., have successful application examples of pressure gauges. Based on the application requirements of the aforementioned products, the direction of low pressure gauge module component cost and low pressure gauge module volume, etc., It is the test faced by the existing pressure gauge module construction, because most of the cost of a single pressure sensor is concentrated on the construction cost. The two-stage production method mode of the base and the external cov...
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IPC IPC(8): H01L27/144H01L23/488H01L23/31H01L21/78H01L21/50H01L21/56H01L21/60
CPCH01L2224/32245H01L2924/1815H01L2224/73265H01L2224/48247H01L2924/15151H01L2924/16235H01L2924/181
Inventor 陈荣泰朱俊勋
Owner IND TECH RES INST