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Device for canceling wafer sample surface charge effect and its usage method

A surface charge, wafer technology, applied in the field of surface analysis, can solve the problems of affecting other weak signal collection, high cost, low success rate, etc.

Inactive Publication Date: 2010-02-24
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Plating Pt on the sample surface will cause damage to the sample surface, and too strong Pt signal will also affect the collection of other weak signals; the success rate of sample preparation with aluminum foil with small holes on the sample surface is very low; Charge compensation on the sample surface requires special equipment and is expensive

Method used

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  • Device for canceling wafer sample surface charge effect and its usage method
  • Device for canceling wafer sample surface charge effect and its usage method
  • Device for canceling wafer sample surface charge effect and its usage method

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specific Embodiment

[0034] The device that present embodiment proposes is made of three parts, see image 3 :

[0035] The metal grid 5, the base 1 of the sample stage and the bolt assembly constitute.

[0036] The sample stage consists of a pedestal and a support table that supports the wafer.

[0037] The pedestal is basically the same as the existing pedestal. A protruding metal block for supporting the wafer to be analyzed is respectively connected to the left and right sides of the pedestal as a supporting platform for supporting the sample. In order for the bolts to pass through, a circular through hole is formed on the supporting platform, the diameter of the circular through hole is also greater than the diameter of the screw of the bolt, and smaller than the diameter of the bolt head, the diameter of the through hole is also greater than the diameter of the screw of the bolt 40, smaller than the diameter of the bolt head. So that the bolt 40 can pass through the through hole. The pos...

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PUM

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Abstract

The invention discloses a set of charge removing devices. During the surface analysis of a wafer, the analysis is easy to make an error due to the fact that the surface of the wafer has a charge effect. The invention eliminates the problem by a set of devices and the corresponding using method. The devices provided by the invention comprise: a metal mesh, a sample stage and a bolt assembly. When the wafer is placed on the sample stage, the metal mesh is put down to conduct the accumulated charges on the surface of the wafer away through the metal mesh. The invention conveniently and effectively solves the problem that the charge effect produces the analysis error.

Description

technical field [0001] The invention relates to a device and a method for surface analysis in the field of semiconductor integrated circuit manufacturing, in particular to a device and a method for eliminating charge on the surface of a wafer during surface analysis in the semiconductor integrated circuit. Background technique [0002] With the development of the semiconductor industry, the Auger electron spectrometer (hereinafter referred to as Auger) used for surface analysis has been more and more widely used in the semiconductor industry due to its extremely high sensitivity to elements around 70A on the sample surface. Especially in the analysis of surface contamination. [0003] But the charge effect of the surface material of the sample has more and more serious influence on the Auger sample. [0004] For example, when used in Auger analysis, the charge effect has a serious impact on the analysis results. [0005] Auger uses the Auger electron spectrum obtained duri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/28H01L21/66H05H3/02
Inventor 周晶虞勤琴李明赵燕丽
Owner SEMICON MFG INT (SHANGHAI) CORP