Strengthening type three-layered wood compound floor board and mfg. method thereof

A technology of solid wood composite flooring and its manufacturing method, which is applied in the field of reinforced three-layer solid wood composite flooring and its production, and can solve problems such as debonding, glue separation between the surface layer board and the core layer board, and easy cracking of the surface layer board, so as to reduce the probability of cracking , prevent the glue layer from cracking, and improve the stability

Inactive Publication Date: 2007-07-18
上海新四合木业有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0002] At present, the multi-layer solid wood composite floor is used in various places, because it has the characteristics of environmental protection, not easy to deform, good viewing effect, long service life, relatively cheap price, etc., so it is widely accepted by people, but the current solid wood composite floor Most of the core boards use density boards. For example, the utility model patent of "a solid wood composite laminated floor" with Chinese patent number 200420030659.9 uses high-density boards as the core layer in the five-layer structure. It i...

Method used

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  • Strengthening type three-layered wood compound floor board and mfg. method thereof
  • Strengthening type three-layered wood compound floor board and mfg. method thereof

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Embodiment Construction

[0027] Referring to Fig. 1, Fig. 2, wherein, surface solid wood board 1 is hard wood such as oak, walnut, teak, merbau, balsam, jatoba, birch, maple, elm, southwest birch, hard maple and other materials; chemical fiber non-woven fabric 2 uses 10-50g / m 2 chemical fiber non-woven fabric; one side of the core board 3 is coated with an adhesive and non-woven fabric, and the surface solid wood board 1 is bonded together through the non-woven fabric; the other side of the core board 3 is glued to the backboard 4 connected together; there are floor tenon grooves 5 and floor tenons 6 around the core board 3 .

[0028] Referring to Fig. 2, the three-layer reinforced parquet manufacturing process flow chart, wherein,

[0029] 2-1, making the surface solid wood board; dry sawing the hard wood and planing on all sides to form a solid wood board, then saw the solid wood board into boards, that is, the surface solid wood board, put the surface solid wood board into a drying kiln to dry, an...

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Abstract

The present invention relates to one kind of three-layer reinforced laminated wooden floor board and its making process. The three-layer reinforced laminated wooden floor board includes one surface wood layer, one core layer and one back layer adhered to the core layer, and has one chemical fiber non-woven fabric layer adhered between the core layer and the surface wood layer. The making process of the three-layer reinforced composite wooden floor board includes the following steps: making surface wood board, selecting core layer board, making back board, combination and pressing, splitting and balancing, and forming. Compared with available technology, the present invention has the advantages of raised adhesion strength, less cracking and high stability.

Description

technical field [0001] The invention relates to building decoration materials, in particular to a reinforced three-layer solid wood composite floor and a manufacturing method thereof. Background technique [0002] At present, the multi-layer solid wood composite floor is used in various places, because it has the characteristics of environmental protection, not easy to deform, good viewing effect, long service life, relatively cheap price, etc., so it is widely accepted by people, but the current solid wood composite floor Most of the core boards use density boards. For example, the utility model patent of "a solid wood composite laminated floor" with Chinese patent number 200420030659.9 uses high-density boards as the core layer in the five-layer structure. It is a wear-resistant paper impregnated with melamine, and a thin wood and a balance layer are pressed between the high-density core board; the Chinese patent number is 200320122776.8, a utility model patent for "a comp...

Claims

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Application Information

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IPC IPC(8): E04F15/02B27M3/04
Inventor 张古墨
Owner 上海新四合木业有限公司
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