Temperature equality device and temperature equality method in glass forming

A glass forming and uniform technology, applied in glass forming, glass forming, glass manufacturing equipment and other directions, can solve the problems of uneven thickness, uneven local temperature, and difficulty in forming, to improve quality and yield, reduce Effects of thickness and curvature changes

Inactive Publication Date: 2007-08-08
HENAN ANCAI HI-TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The present invention overcomes the deficiencies in the prior art that easily cause uneven local temperature, uneven thickness, complicated control means, and difficult molding, and provides a glass molding that greatly improves the quality of glass molding and reduces the difficulty of operation. Temperature uniform device and temperature uniform method in

Method used

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  • Temperature equality device and temperature equality method in glass forming
  • Temperature equality device and temperature equality method in glass forming
  • Temperature equality device and temperature equality method in glass forming

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Embodiment Construction

[0026] As shown in Figure 2, the utility model includes a forming body 104 formed by molten glass overflowing on it, a heating forming space formed by a top heating element 102 and a side wall heating element 103 arranged outside the forming body 104, and a heating forming space arranged on the top of the forming body 104. The thermal insulation part 101 outside the heating element and the side wall heating element is provided with a temperature uniform device 105 between the molding body 104 and the top heating element 102 and the side wall heating element 103, and its function is to collect the thermal energy radiated to the molten glass, and The molten glass is heated in the form of surface radiation, so that the glass flow can obtain a relatively uniform temperature; the temperature uniform device 105, that is, the uniform temperature equipment 105, is a silicon carbide uniform temperature plate, which seals the molded body 104 in the internal space, and the top heating elem...

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Abstract

The invention discloses a temperature evening device and method in the glass moulding course, which comprises the following parts: moulding bulk to overflow fusing glass, heating moulding space with top heating element and lateral heating element, insulating part on the exterior of top heating element and lateral wall heating element, board-shaped temperature evening device on the periphery between overflow glass liquid moulding bulk and heating element, wherein the board-shaped temperature evening device gathers glass fusing heat to heat glass at face irradiation pattern, which makes glass flow obtain even temperature; the distance between board-shaped temperature evening device and fusing glass and relative position of back heating element are adjusted to control temperature of fusing glass temperature.

Description

Technical field: [0001] The invention belongs to the field of glass manufacturing of flat panel display devices, and the invention relates to a temperature uniform device and a temperature uniform method used in glass molding used when the glass substrate is formed by an overflow method in the flat panel display glass substrate manufacturing process. Background technique: [0002] The quality of the glass substrate plays a very important role in the display effect of the new flat panel display, because many transistors and connections are formed on the glass used in the display, especially in the thin film transistor display (TFT-LCD). Various circuit diagrams surrounding devices and controlling display parameters are mostly at the micron level. If there are scratches or protrusions larger than the line width on the glass surface, problems such as short circuits will occur. Manufacturing shows that a smooth and tidy glass substrate is a display One of the conditions with goo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B17/06
CPCC03B17/064
Inventor 贾伟李栋王晶
Owner HENAN ANCAI HI-TECH
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