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Surface treating agent and method for manufacturing coating using the same

A surface treatment agent and film technology, used in solid-state chemical plating, welding media, coatings, etc., can solve the problems of complicated treatment methods, hindering the formation of film, and increasing environmental load.

Inactive Publication Date: 2011-04-13
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] But, for the method described in JP-A No. 52-72342 A, JP-A-6-81161 A, JP-A-9-291372 A, because of using a complex chelating agent during waste liquid treatment, Therefore, there is a possibility that the environmental load will increase
In addition, since the chelating agent described in the above-mentioned gazette inhibits the formation of a film on copper, there is a possibility that the solderability may be lowered in the method described in the above-mentioned gazette.

Method used

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  • Surface treating agent and method for manufacturing coating using the same
  • Surface treating agent and method for manufacturing coating using the same
  • Surface treating agent and method for manufacturing coating using the same

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Embodiment Construction

[0010] The surface treatment agent of the present invention is used for the purpose of forming a film on the copper surface forming wiring, for example, for rust prevention, improvement of solderability, and the like. The surface treatment agent contains an imidazole compound that is a main component of the film to be formed, and a sugar alcohol bonded to copper ions dissolved in the surface treatment agent. Thereby, film formation on dissimilar metals can be suppressed, and since sugar alcohol is used, compared with surface treatment agents using conventional chelating agents, waste liquid treatment becomes easier and environmental load can be reduced. In addition, when the above-mentioned surface treatment agent is used as a water-soluble preflux, even after a high-temperature treatment process such as reflow, solderability does not decrease, and a film with high heat resistance can be formed.

[0011] The above-mentioned surface treatment agent can be prepared, for example,...

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Abstract

A surface treating agent for copper or copper alloy is provided, including an imidazole compound and sugar alcohol. According to the surface treating agent, copper ions dissolving into the surface treating agent combine with the sugar alcohol, and therefore the formation of a coating on a dissimilar metal can be suppressed. Further, since the sugar alcohol is used, a treating process of its liquid waste will become easy and a load on environment can be reduced.

Description

technical field [0001] The present invention relates to a surface treatment agent for copper or copper alloy and a film forming method using the surface treatment agent. Background technique [0002] Conventionally, as a surface treatment agent for forming a film for the purpose of rust prevention and improvement of solderability of circuit wiring made of copper or copper alloy (hereinafter also simply referred to as "copper"), there is known a benzimidazole-containing OSP (water-soluble preflux) of isoimidazole compounds (for example, refer to JP-A-7-54169, JP-A-5-237688, JP-A-5-163585, JP-A-11-177218). [0003] On the other hand, in printed wiring boards, metals other than copper such as gold, silver, aluminum, tin, and solder (hereinafter also referred to as “dissimilar metals”) may coexist on copper wiring. Treatment with a water-soluble pre-flux containing the above-mentioned imidazole compound may cause problems such as film formation on dissimilar metals and discolor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F11/00C23C22/00B23K35/36C07D233/00C07D235/00
CPCH05K2203/124H05K3/282C23F11/173C23C22/06C23F11/149C23F11/122C23C22/52H05K2203/122C23C20/00C23C22/00
Inventor 古川良昭矢熊纪子西江健二
Owner MEC CO LTD