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Large-power light-emitting diodes gluing process

A technology of light-emitting diodes and glue dispensing technology, applied in electrical components, electric solid devices, circuits, etc., can solve problems such as colloid and shell cracks, exposed wires, colloid cracking, etc., to ensure uniformity, reduce failure ratio, reduce bubble effect

Active Publication Date: 2010-05-12
浙江古越龙山电子科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Using the existing packaging and dispensing process of high-power light-emitting diodes, the colloid filled inside will generate internal stress due to sudden temperature changes in the range of -40-120°C, which will easily disconnect the gold wire from the lead frame, and even the chip. Cracks appear between the silver glue, the silver glue and the bracket, the glue and the shell, resulting in dead lights
In addition, due to the problems existing in the existing dispensing process, there will also be glue overflow (glue overflowing the shell), less glue, air bubbles and improper needle control. The appearance of overflow glue will affect the subsequent testing and packaging operations, and less glue will cause wires The appearance of air bubbles affects the light-emitting efficiency and changes the direction of light. Moreover, the expansion coefficients of air and resin are different. After being heated, the colloid will crack and affect the quality of the light-emitting diode (LED). Improper control of the needle can easily cause the shell damage, thus affecting the production pass rate of high-power light-emitting diodes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment 1: as figure 1 and figure 2 As shown, the dispensing process of high-power light-emitting diodes is:

[0015] a. Preheating: The high-power LED semi-finished product to be dispensed is preheated in an oven at a temperature of 100°C for 2 hours.

[0016] b. Vacuum defoaming: Vacuum defoaming of the pre-configured silicone resin (EG6301) and epoxy resin (#81003) mixture (also called glue, the same below) for 20 minutes,

[0017] c. Pour into the syringe: the mixture of silicone resin (EG6301) and epoxy resin (#81003) after defoaming is slowly poured into the syringe 1 along the wall of the syringe to reduce air bubbles,

[0018] d. Air bubble removal: After the syringe 1 is connected to the piston 2 and the air pipe 3, use machine vacuum back suction to remove the air bubbles in the mixture of silicone resin (EG6301) and epoxy resin (#81003) in the syringe 1,

[0019] e. Air pressure defoaming: Use air pressure to further remove the air bubbles in the mixtu...

Embodiment 2

[0029] Embodiment 2: as figure 1 and figure 2 As shown, the dispensing process of high-power light-emitting diodes is:

[0030] a. Preheating: The high-power LED semi-finished product to be dispensed is preheated in an oven at 120°C for 6 hours

[0031] b. Vacuum defoaming: vacuum defoaming of pre-configured epoxy resin (T7007) for 10 minutes,

[0032] c. Filling into the syringe: the defoamed resin is slowly poured into the syringe 1 along the wall of the syringe,

[0033] d. Air bubble removal: After the syringe 1 is connected to the piston 2 and the air pipe 3, the machine vacuum is used for 10 seconds to remove the air bubbles in the resin in the syringe 1.

[0034] e. Air pressure air bubble removal: use air pressure to further remove the air bubbles in the resin in the syringe 1 through the needle 4, and continue for 10 seconds,

[0035] f. Origin correction and position correction: perform origin correction and dispensing position correction on the needle 4 of the ...

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Abstract

The invention is concerned with the high-power LED dot glue technics. The process is: preheating - vacuum doff and dunk - fill in pin canister - evacuate bubble - air pressure evacuate bubble - origincorrection and position correction - transmission - pinhead descend - crush glue - pinhead raise - leave produce - draw back pinhead - wipe pinhead. The second time and the following repeat the abovesteps. The invention can not damage the produce and happen other bad phenomenon.

Description

technical field [0001] The invention relates to a packaging process of light-emitting diodes, in particular to the dispensing technology of the packaging process of high-power light-emitting diodes. Background technique [0002] The packaging forms of light-emitting diodes (LEDs) are divided into various packaging forms such as pin type, code tube or meter-shaped tube, symbol tube, rectangular tube, surface mount package, etc. In recent years, light-emitting diode (LED) chips and packages have developed towards high power. Under high current, the luminous flux is 10-20 times larger than that of Φ5 mm light-emitting diodes (LEDs). Effective heat dissipation and non-deteriorating packaging materials and packaging materials must be used. Technology solves the problem of light decay. Therefore, the packaging and dispensing process of light-emitting diodes (LEDs) that can withstand several watts (W) of power directly affects the quality of high-power light-emitting diodes. [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L21/56B05C5/02H01L33/52
CPCH01L2224/48091H01L2924/181
Inventor 丁申冬许振军陈建伟陈丹萍张伟刚
Owner 浙江古越龙山电子科技发展有限公司
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