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Large power thick film circuit resistance paste of stainless steel substrate and preparing method thereof

A thick film circuit, resistor paste technology, applied in resistor manufacturing, conductive materials dispersed in non-conductive inorganic materials, non-adjustable metal resistors, etc., can solve the problems of large size, difficult design, short life, etc. The effect of good electrical conductivity, low resistance, excellent printing characteristics and firing characteristics

Inactive Publication Date: 2007-09-19
吴胜红 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, high-power resistors (100-1000W), high-power electric heating elements (100-1000W) and other large-area components are generally made of wire-wound resistance wires, which have the characteristics of large size, short life, and difficult design. It is becoming more and more difficult to meet the stringent requirements of miniaturization, high reliability and long life of various electrical appliances

Method used

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Embodiment Construction

[0045] Below in conjunction with specific embodiment the present invention is described in further detail:

[0046] The resistance paste for high-power thick-film circuit based on stainless steel substrate of the present invention is made up of solid-phase component (silver-palladium powder+ceramic powder) and organic binder, and the ratio (weight ratio) of solid-phase component and organic binder is ) is (70~90): (30~10), the ratio (weight ratio) of silver-palladium powder and glass-ceramic powder in the described solid-phase composition is (60~99): (40~1); The particle size of the palladium powder and the silver powder is less than 2 microns, and the ratio (weight ratio) of the palladium powder to the silver powder is (1-10):(99-90).

[0047] As a further improvement of the present invention, the glass-ceramic is SiO2~Al2O3~Cao~Bi2O3 series glass-ceramics, and various raw materials and proportioning (weight ratio) are:

[0048] SiO2: 10-40%, Al2O3: 10-30%,

[0049] Cao: 20...

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Abstract

The invention relates to a large-power thick-film circuit resistor sizing agent based on a stainless steel substrate and a manufacturing method thereof. The invention provides a resistor sizing agent with a low resistance, excellent insulative performance, printing characteristic and burning characteristic, and which is matched with an insulated stainless steel substrate. The manufacturing method of the invention comprises: A, manufacturing glass powders; B, preparing an organic adhesive; C, concocting the sizing agent: concocting a solid component of silver powers, palladium powers and crystallite glass powers in proportion, arranging the solid component and the organic adhesive in a milling pot in proportion, and milling the solid component and the organic adhesive in the milling pot. The invention selects crystallite glass as binding phase, an expanding coefficient of a resistor track layer of the invention is matched and combined with a stainless steel well; the resistor track layer of the invention has advantages of low resistance, compatible with medium mateiral used of the thick film circuit of the stainless steel substrate and electrode sizing agent, and good conductive performance, etc.

Description

technical field [0001] The invention relates to a resistance paste for high-power (tens of watts to several thousand watts) thick-film circuits based on stainless steel substrates, in particular to a resistance paste for high-power thick-film circuits based on stainless steel (430, 444 series) substrates materials and their preparation methods. Background technique [0002] In the field of thick-film circuit technology, traditional substrates include polymer and ceramic substrates, both of which have their own partiality. The polymer substrate has low thermal conductivity, high expansion coefficient, and poor stability at high temperature (greater than 100°C). The ceramic substrate includes Al 2 o 3 And AIN, etc., its size is small, generally not larger than 100×100mm 2 , and the mechanical performance is poor, and the assembly of the whole machine is difficult. The surface-insulated stainless steel substrate developed in recent years has attracted more and more attenti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H01C7/00H01C17/065C09D5/24H01L27/01H01L21/00H05K1/16H05K3/12
CPCC03C8/18H01C17/06533H05K1/053H05K1/092C03C2207/04H05K1/167
Inventor 吴胜红邓泰均宁青菊
Owner 吴胜红
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