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Mounting apparatus

A mounting and surface plate technology, applied in the manufacture of electrical components, heat exchange equipment, semiconductor/solid-state devices, etc., can solve problems such as the weight of the top plate 1 and the prolonged heating and cooling time of the wafer

Active Publication Date: 2007-09-19
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in order to reduce the influence of the cooling jacket 2, it is conceivable to thicken the top plate 1, but in this case, the heat capacity will increase corresponding to the thickened part of the top plate 1, and the heating and cooling time of the wafer will become longer, and , the top plate 1 itself becomes heavier

Method used

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Experimental program
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Effect test

no. 1 approach

[0042] First, an inspection device to which the mounting device of this embodiment is applied will be described. This inspection apparatus includes, for example, as shown in FIG. Under the control of the device, the wafer W is transferred from the load chamber L to the probe chamber P, and after the electrical characteristics of the wafer W are inspected in the probe chamber P, the wafer W is returned to the original position.

[0043] As shown in FIG. 1 , the probe chamber P includes: a mounting device (wafer chuck) 10 that mounts a wafer W and can adjust its temperature; The XY stage 20; the probe card 30 arranged above the wafer holder 10 moved by the XY stage 20; Positioning mechanism 40 for accurate positioning of electrode pads.

[0044]In addition, as shown in FIG. 1 , a test head (test head) T of a tester (tester) can be rotatably arranged on the top plate 50 of the probe chamber P, and the test head T and the probe card 30 pass through the performance board (perform...

no. 2 approach

[0062] In the first embodiment, the flatness of the top plate can be improved, the thermal conductivity can be improved, the heating and cooling time of the object to be processed can be shortened, and the weight can be reduced. In the case of the mounting device 10 of the first embodiment, even if the temperature changes from +25°C to +150°C, the flatness of the top plate can be maintained at about 2.6 μm, which is significantly improved compared with the conventional 10 μm. The effect on thermal deformation was confirmed.

[0063] However, it has been found through subsequent experiments that, in the case of the mounting device 10 described above, the flatness of the top plate is affected by the bending of the lower parts, that is, the cooling jacket 12, the heat insulating ring 15, and the heat insulating plate 16, etc. during assembly. Influence, when the mounting device is assembled, the flatness of the top plate is reduced. The cooling jacket 12 and the heat insulating ...

no. 3 approach

[0073] As a result of studying the heating and cooling of the mounting devices 10 and 10B according to the first and second embodiments, not to mention the conventional mounting devices, it has been found that since the outer peripheral surfaces of components such as the top plate are exposed, even if the fastening of the top plate and the like is improved, In this method, due to disturbances such as heat dissipation from the outer peripheral surface of components such as the top plate and heat entering from the outside, the temperature of the outer peripheral portion of the top plate will drop or rise, etc., which will affect the inspection.

[0074] Therefore, in the present embodiment, a measure for suppressing the above-mentioned temperature change is sought by attaching the plate ring for heat preservation to the outer peripheral surface of the mounting device. Hereinafter, the placement device of this embodiment will be described with reference to FIG. 4 .

[0075] The m...

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Abstract

To provide a mounting apparatus capable of shortening time required for raising and lowering a temperature of a target object by way of improving the flatness of an assembled top plate and at the same time suppressing the deterioration of the flatness of the top plate by the temperature variation from a low temperature to a high temperature.A wafer chuck 10A includes a top plate 11, a temperature control unit 14 formed of a cooling jacket 12 and a plate heater 13 integrated with the top plate 11, and a heat insulation plate 16 integrated with the temperature control unit 14 through a heat insulation ring 15, the top plate 11 being formed of ceramic. The top plate 11, the cooling jacket 12, and the plate heater 13 are coupled to each other by a third bolt 18C at each portion thereof except for each peripheral portion thereof such that the peripheral portion of the top plate 11 being not coupled thereto, and the cooling jacket 12 and the heat insulation ring 15 are coupled together by a second bolt 18B.

Description

technical field [0001] The present invention relates to a mounting device that mounts an object to be processed and adjusts it to a predetermined temperature when processing an object to be processed such as a wafer. . Background technique [0002] A conventional loading device, for example, as shown in FIG. 5 , includes a top plate 1, a temperature regulating body 4 composed of a cooling jacket 2 integrated with the top plate and a surface heater 3, and a temperature regulating body connected to the temperature regulating body through an insulating ring 5. The integrated heat insulating plate 6 absorbs and holds the wafer (not shown) on the upper surface of the top plate 1, and the wafer is adjusted to a predetermined temperature by the temperature regulator 4, and a predetermined process is performed on the wafer. The top plate 1, the cooling jacket 2 and the surface heater 3 are fastened by a plurality of bolts 7A arranged concentrically at a predetermined interval in th...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCF28F13/00H01L21/67109H01L21/67103F28D2021/0077H01L21/687H01L21/683
Inventor 赤池由多加长坂旨俊
Owner TOKYO ELECTRON LTD
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